|Second generation of AMD’s modularcore architecture – codenamed “Piledriver”
- Higher performance and higher performance/watt than the previous generation.
- Same power bands and power saving features.
- Socket compatible.
- Delivers improved TCO with higher performance and better price/performance
than the previous generation.
- Provides enhanced power efficiency by running applications faster while staying
within the same power budget.
- Extends life of investment by leveraging current socket platform.
|Cache and Core Count
||Up to 16 cores within the same package, 1MB L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB L3 cache per socket.
|Offers improved performance and performance/watt (compared to prior generations) for multi-threaded environments like virtualization, database and web serving.
|Higher DDR3 Frequencies
||DDR3-1600 now supported for typical memory configurations; DDR3-1866 supported in slightly loaded memory configurations.
||Helps to improve overall system performance.
|Quad Channel Memory
||Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM.
||Can increase performance especially in memory-intensive workloads.
|AMD Turbo CORE Technology
||AMD Turbo CORE technology helps boost performance by allowing all of the cores to boost performance by up to 300MHz simultaneously when headroom is available.
||Gain added clock speed for improved performance.
||Provides hardware acceleration to enable fast and secure data encryption and decryption.
||Realize improved application performance.
|TDP Power Cap
||The thermal design power (TDP) can be set in one watt increments using the BIOS or APML so that customers can “dial in” their server power loads in order to get the most processing power into a single rack, maximizing the power budget.
||Get more flexible, denser deployments, translating into more servers in a rack.
|C6 Power State
||Core power gating: Any module can enter C6 where the module is saved to DRAM and the voltage is completely gated off. This allows other modules to increase frequency.
||Get reduced power costs during times of low usage.
||APML (Advanced Platform Management Link)
||Provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor.
||Remotely monitor and control power and cooling.
|AMD CoolSpeed Technology
||Enables the server to automatically drop into lower power mode if processor’s thermal environment exceeds safe operational limits and offers platform providers the ability to safely reduce system fan speeds, which helps deliver greater platform efficiency.
||Helps protect processor from overheating.
||Reduces power just beyond the processor.
||Reduces memory controller and HyperTransport™ technology links’ power.
||Supports DDR3 at 1.25V in addition to 1.35V.
||Helps to reduce overall power consumption.
||Enables extremely dense memory configurations.
||Help reduces memory-bottleneck in memory intensive environments such as virtualization.
|Direct Connect Architecture 2.0
||HyperTransport™ Technology Assist (HT Assist)
||Helps to increase coherent memory bandwidth and reduce latency in multi-nodesystems by reducing cache probe traffic between cores.
||Enhances a server’s efficiency and scalability by helping to reduce cache probe bus traffic.
|HyperTransport™ 3.0 Technology (HT3)
||Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3.
||Helps improve overall system balance and scalability.
|AMD-V™ 2.0 Technology
||AMD Virtualization™ (AMD-V™) 2.0 Technology
- Tagged TLB — Efficient switching between virtual machines for better application responsiveness.
- Rapid Virtualization Indexing — Hardware-based virtual machine memory management.
- AMD-V™ Technology Extended Migration — Helps enable live migration of VMs between all available AMD Opteron™ processor generations.
- I/O Virtualization — Enables direct device access by a virtual machine for increased integrity and security.
- Easy to deploy — Larger pool of resources enables greater VM consolidation.
- Easy to manage — Common architecture makes managing virtual pools easy.
- Easy to move — extended migration delivers great flexibility for load balancing and disaster recovery.