|Second generation of AMD's modular core architecture – codenamed "Piledriver"
- Higher performance and higher performance/watt than the previous generation
- Same power bands and power saving features
- Socket compatible
- Low TCO with better performance1 and price/performance
- Runs applications faster1 within the same power budget
- Helps extend life of investment by leveraging current socket platforms
|Cache and Core Count
||Up to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket.
||Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving.
|Higher DDR3 Frequencies
||Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations.
||Helps improve system performance.
|Quad Channel Memory
||Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM.
||Can increase performance, especially in memory-intensive workloads.
|AMD Turbo CORE Technology
||Cores can boost performance by up to 300MHz simultaneously when headroom is available.
||Adds clock speed for improved performance.
||Provides hardware acceleration for fast and secure data encryption and decryption.
||Helps improve application performance.
|TDP Power Cap
||Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack.
||Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies.
|C6 Power State
||Core power gating reduces and increases voltage as needed.
||Helps reduce power costs during times of low usage.