Enabling today.
Inspiring tomorrow.

 Product Stewardship


For more information, download the Product Stewardship section of our 2013/2014 Annual Corporate Responsibility Report

Energy-Efficient Computing

The energy efficiency of AMD’s semiconductor products has continued to improve as measured by the energy used per compute capability. Over the past six years, AMD mobile platform typical energy use has dropped almost 60 percent while compute capability has improved nearly 4.5-fold.

Product Content

AMD works to minimize the environmental impact of the materials used in our products during their lifecycle.

Lead: Lead in electronic products has been restricted by regulation in a number of countries over the past several years. We have introduced “Lead-Free”1 CPU and APU products to the market and offer products compliant with the Restriction of Hazardous Substances (RoHS) in electronics requirements of the European Union (EU), China and other countries. View AMD’s RoHS Compliance Statement on our website.

Halogens: Halogens refer to a class of chemical compounds containing one or more elements in the halogen family (such as chlorine or bromine). Beginning in early 2009, AMD introduced new microprocessor and graphics products that are “Halogen-Free2.” AMD’s APU processors “Kabini”, “Richland” and “Temash,” introduced in 2013, as well as our most recent processors for gaming consoles are all Halogen-Free.

REACH: Since the transfer of our wafer manufacturing assets in 2009, much of the compliance requirements for EU’s Registration, Evaluation, Authorization and restriction of Chemical substances (REACH) regulation are handled by our supply chain partners. Nevertheless, we continue to track developments and collaborate with our supplier partners in order to address REACH requirements.

End-of-Life Extension

AMD products can also help extend the life of computing platforms, thus reducing electronic waste. In many cases, AMD chips are “backwards compatible” with previous generation AMD chips. For example, AMD Richland desktop platforms utilize the same socket as our previous generation products. This means that processor upgrades can occur while avoiding hardware replacements and the associated waste. To proliferate this efficient approach, AMD participates in the Open Compute Project that encourages the use of open, standardized server platforms.

Product Packaging

AMD specifies the packing materials used for our products, including recyclability of materials and use of recycled content. Our packaging designers continuously seek out environmentally preferable packing materials and methods to minimize packing that meet our needs for product protection, cost, material properties and compliance with industry standards.

Our packaging requirements limit the presence of certain heavy metals, such as lead and cadmium; include marking plastic parts with the appropriate Society of the Plastics Industry (SPI) International Resin Codes for recycling; and include the use of water-based inks and dyes. AMD no longer uses PVC in any of our packing materials, and incorporates the use of unbleached cardboard and clay-coated news back (CCNB)3.

In 2008, AMD started the transition from wooden pallets to plastic pallets for product transportation because plastic pallets are more readily reused and recycled. In 2013, the use of the lighter plastic pallets resulted in an approximate reduction of 687,1934 pounds of CO2 savings (equivalent to the carbon in 439 old growth trees) and an estimated freight cost savings of $193,000.