The AMD64 core provides leading-edge 32-bit performance, seamless 32-to 64-bit migration and therefore investment protection

• AMD64 technology features uncompromising 32-bit performance and is ready for tomorrow’s software, today.
• Vastly expands memory addressability with 40-bit physical addresses, 48-bit virtual addresses
• Doubles the number of internal registers with eight additional (sixteen total) 64-bit integer registers and eight additional (sixteen total) 128-bit SSE/SSE2/SSE3 registers
• Incorporating 3DNow!™ Professional technology, SSE2 and SSE3, AMD Turion 64 mobile technology is compatible with the largest installed base of multimedia-enhance software

Enhanced Virus Protection with Windows® XP SP2

• Enhanced Virus Protection enabled by Windows XP Service Pack 2 is designed to prevent the spread of certain viruses, like MSBlaster and Slammer, significantly reducing the cost and down-time associated with similar viruses and improving the protection of computers and personal information against certain PC viruses.*

High-bandwidth, low-latency integrated memory controller

• Provides a performance boost by directly connecting the processor to the memory, thus dramatically reducing memory latency.
• Supports industry-standard, widely-available PC3200,PC2700, PC2100 or PC1600 DDR SDRAM memory
• Unbuffered SO-DIMMs
• Features ECC protection that enables increased system reliability, helping to ensure your systems run smoothly
• Up to 3.2 GB/s memory bandwidth

HyperTransport™ technology for high speed I/O communication

• HyperTransport technology helps increase overall system performance by helping reduce traditional system bottlenecks, increasing I/O bandwidth, and reducing I/O latency; which translates into overall better performance.
• One 16-bit link supporting up to 1600MHz
• Up to 6.4GB/s peak HyperTransport™ I/O bandwidth

 Large high performance, on-chip cache

• 64KB Level 1 instruction cache
• 64KB Level 1 data cache
• Up to 1MB Level 2 cache
• Improved branch prediction for greater accuracy in anticipating instruction calls
• Enhanced TLB structures for better memory management of complex workloads

Made for mobility

• AMD PowerNow!™ technology extends battery life by dynamically switching the performance states (processor core voltage and operating frequency) based on processor performance requirements
• Additional C3 Deeper Sleep state reduces power consumption during idle moments

Wireless Compatibility

• Compatible with currently available 802.11 a, b and g wireless solutions
• AMD enables a choice of best-in-class wireless solutions

Packaging: 754-pin lidless micro PGA, organic package. Die size: Approximately 114 million transistors on 115mm 2. Processors are manufactured using AMD's state-of-the-art 90nm SOI technology optimized for mobile processors at AMD's Fab 30 wafer fabrication facility in Dresden, Germany.

*Enhanced Virus Protection will by default only protect the user's Windows operating system. Users must, at installation of Microsoft Windows® XP Service Pack 2 or when they first purchase their system, choose to enable the protection of their applications and associated files from memory buffer overrun attacks. AMD and Microsoft strongly recommend that users use third party anti-virus software as part of their security strategy.