| Q: | Is AMD committed to providing “Pb-free” products?
|
| R: | Yes. Lead (Pb) has come under increased environmental scrutiny due
to end of life treatment and disposal considerations for electronic
products. For this reason, a variety of jurisdictions around the globe
have proposed or finalized regulations that would restrict the use of
Pb. For example, the European Union and China have established a
phase-out date of July 1, 2006 for Pb in electronic products with some
exceptions. AMD engineers are working to develop effective Pb-free
technical solutions while minimizing costs and without sacrificing other
product features. |
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|
| Q: | What definition of “Pb-free” does AMD use?
|
| R: | AMD is asking our suppliers to provide Pb-free solder and other
materials that have a maximum of 0.1% Pb (percent by weight) as an
impurity. This is the maximum allowable concentration for lead found
in EU Directive 2000/53/EC for vehicle end of life, and is also the
definition most commonly being provided by customers. AMD will
comply with the Pb-free definitions that are eventually incorporated
into the EU RoHS Directive 2002/95/EC. |
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|
| Q: | Where is lead (Pb) found in AMD’s PCSG products?
|
| R: | Small amounts of Pb are found in or on the package interconnects of
packages which are not classified as ‘Pb-free’. Examples are the solder
spheres on BGA-style packages, and the plated material on the leads
of lead frame-style packages. In addition, certain AMD Geode™ NX
processors utilize internal flip-chip interconnections containing Pb,
which are exempt from European Union legislation. |
|
|
| Q: | Do AMD products contain any of the other chemicals that are
being banned by the EU RoHS Directive (cadmium, mercury,
hexavalent chromium, PBB and PBDE flame retardants)?
|
| R: | AMD does not intentionally use these other chemicals in our
processors. In addition, we are working with our suppliers to reduce
concentrations of these chemicals when they are present in materials
as impurities, for example cadmium in solder. |
|
|
| Q: | Why do AMD PCSG Cu leadframe products use matte Sn or
Sn-2.0Cu in spite of concerns regarding whisker growth?
|
| R: | Matte Sn or Sn-2Cu plating has been chosen for AMD PCSG Pb-free Cu
leadframe products for the following reasons:
-
Both plating materials are compatible with existing SnPb and Pbfree
board assembly processes.
- Both plating materials have higher melting points than many
other Pb-free alternatives, which make them acceptable for high
temperature applications.
- Both plating materials have shown Sn whisker growth
characteristics equal to or better than the current requirements
set forth by the National Electronics Manufacturing Initiative
(NEMI) Sn Whiskers Users Group, under reliability stressing
consistent with that group’s directive.
|
|
|
| Q: | Are Quality and reliability standards different for Pb-free
products?
|
| R: | No. Quality and reliability standards are the same for standard and
Pb-free products. |
|
|
| Q: | Where can I find information on the chemicals contained in
AMD products?
|
| R: | The chemical content information for AMD Personal Connectivity
Solutions device packaging is posted in Material Declaration Sheets
that can be obtained by contacting your AMD Sales or Quality
representative.
Contact your AMD Sales or Quality representatives for assistance if you
do not see information for a package of interest. |
|
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