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What’s Next for AMD Manufacturing?
300mm manufacturing is the wave of the future for the semiconductor industry, and AMD is perfectly poised to bring its benefits to our customers. The cornerstone of our 300mm strategy will be the upcoming APM version 3.0, the next and most advanced version of APM to date, which will further extend AMD’s leadership in automated decision-making and advanced process control.
It’s one thing to run a 300mm fab, it’s another thing to run a highly efficient 300mm fab. While 300mm facilities will be able to produce roughly 2.5 times more chips per wafer, the increased wafer-size and chip-design complexities also increase the challenge of ensuring each of those chips operate within acceptable parameters.
The number of useable chips achieved per wafer is commonly referred to as “yield.” In our future fabs, APM 3.0 will allow AMD to take full advantage of the superior yield potential offered by a 300mm manufacturing environment — dramatically reducing fab waste and cost — by extending the already industry-leading capabilities of APM 2.0.
Today, APM 2.0 allows for automated recipe control at the lot level. That means the fab can automatically adjust the recipe for each lot of 25 wafers, to maximize the performance and die yields for that set of wafers.
APM 3.0 is designed to take this capability a massive step forward, enabling true die-level control. This means that the master chip-making recipe can be automatically and uniquely adjusted based on information gathered on every one of the hundreds of chips on each of the thousands of wafers in the fab.
While these technologies are cutting-edge, they are ultimately designed to fulfill one simple idea — efficiency in manufacturing is good for our customers, and APM allows AMD facilities to be as efficient as possible.
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