AMD Opteron™ 4200 Series Processor - Features and Benefits
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AMD Opteron™ 4200 Series Processor - Features and Benefits 


Performance


FEATURE FUNCTION  END-USER BENEFIT
New Core Architecture Optimized performance per watt:
  • Full performance from each core
  • High frequency and low-power design
  • Virtualization enhancements
  • Shared double-sized Flex FP
  • ISA enhancements
The new processor core can enhance power efficiency for server products:
  • Help minimize cooling solution complexities
  • Help reduce power at low utilization
  • Enable more control for IT managers
AMD Turbo CORE Technology Turns unused TDP headroom into added clock speed for improved performance The industry’s best full-core boost1 with up to a 300MHz frequency increase2
ISA Enhancements In addition to baseline instruction support, added SSE4.1, SSE4.2, SSSE3, AVX, AES, PCLMULQDQ, FMA4 and XOP Provides performance enhancements to a wide range of applications
Flex FP The world’s only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module. Enhances flexibility and performance in technical computing


AMD-P 2.0


FEATURE FUNCTION  END-USER BENEFIT
APML (Advanced Platform Management Link) Provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor Remote Power Management Interface (RPMI) in:
  • Ability to monitor and control platform power consumption via p-state limits
  • Access to processor identification and health

Precision Thermal Monitor:
  • Provides accurate information about CPU thermals to closely monitor power/cooling and proactively alert the Base Management Controller (BMC)
  • Early notification helps save time and money by providing intelligence that can be used to more effectively monitor power and thermals to optimize cooling solutions in an IT datacenter
TDP Power Cap Allows the user to set the maximum processor power ceiling via BIOS or APML This technology gives enterprises the ability to customize their chips to meet power and workload demands, providing:
  • More control over power settings
  • Flexibility to set power limits without capping CPU frequencies
AMD CoolSpeed Technology Protects processor integrity by reducing power-states, when a temperature limit is reached
  • Server can automatically drop into lower power mode if processor’s thermal environment exceeds safe operational limits
  • Offers platform providers the ability to safely reduce system fan speeds, which helps deliver greater platform efficiency
C1E Reduces memory controller and HyperTransport™ technology links’ power This feature can equate to a significant power savings in your datacenter depending on system configuration, when the Northbridge and HyperTransport™ technology links are powered down and cores are at idle.
C6 Support Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core. Helps reduce power consumption at idle by up to 37% over the previous generation3
LV-DDR3 Support Supports 1.25V and 1.35V DDR3 Helps to reduce overall power consumption
Higher DDR3 Frequencies DDR3-1600 now supported for typical memory configurations; DDR3-1866 supported in slightly loaded memory configurations (1 of 1 DIMM per channel) Helps to improve overall memory power performance
Ultra-low Power Platform Specialized ultra-low power platforms great for cloud/dense environments Cooperative designs for specialized and ultra-low power platform providing power efficiency beyond just the processor


Direct Connect Architecture 2.0


FEATURE FUNCTION  END-USER BENEFIT
HyperTransport™ Technology Assist (HT Assist) Helps to increase coherent memory bandwidth and reduce latency in multi-node systems by reducing cache probe traffic between cores Reduces the amount of cache prode bus traffic enhancing a server’s efficiency and scalability
HyperTransport™ 3.0 Technology (HT3) Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3 Helps improve overall system balance and scalability
Cache and Core Count Integration of up to 8 cores within the same package, 1MB L2 cache per core (up to 8MB of L2 cache per socket), and a shared 8MB L3 cache per socket Offers improved performance and performance/watt (compared to prior generations) for multi-threaded environments like virtualization, database and web serving

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