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AMD Turion™ 64 Mobile Technology Model Number, Thermal Design Power, Frequency, and L2 Cache Comparison
AMD Turion™ 64 Mobile Technology
Model Number
Thermal Design Power
Frequency
L2 Cache
             
MK-38  
31W
 
2.2 GHz
 
512 KB
       
MK-36  
31W
 
2.0 GHz
 
512 KB
       
ML-44
35W
2.4 GHz
 
1 MB
       
   
ML-42  
35W
 
2.4 GHz
 
512 KB
       
   
ML-40
 

35W

 
2.2 GHz
 
1 MB
       
   
ML-37
 

35W

 
2.0 GHz
 
1 MB
       
   
ML-34
 
35W
 
1.8 GHz
 
1 MB
       
   
ML-32
 
35W
 
1.8 GHz
 
512 KB
       
   
ML-30
 

35W

 
1.6 GHz
 
1 MB
       
   
ML-28
 

35W

 
1.6 GHz
 
512 KB
       
   
MT-40
 

25W

 
2.2 GHz
 
1 MB
             
MT-37
 

25W

 
2.0 GHz
 
1 MB
       
   
MT-34
 

25W

 
1.8 GHz
 
1 MB
       
   
MT-32
 
25W
 
1.8 GHz
 
512 KB
       
   
MT-30
 
25W
 
1.6 GHz
 
1 MB
       
   
MT-28
 
25W
 
1.6 GHz
 
512 KB
         
 
Competitive Comparison
   
 
AMD Turion™ 64 Mobile Technology
Intel Pentium® M
         
Architecture Introduction
 
2003
 
2003
         
On-chip L1 Cache (Instruction + Data)
 
128KB (64KB + 64KB)
 
64KB (32KB + 32KB)
         
On-chip L2 Cache
 
1024KB/512KB (exclusive)
Total Effective Cache: 1152KB/640KB
 
2048KB (Inclusive)
Total Effective Cache: 2048KB
         
System Bus Technology
 

HyperTransport™ technology @ up to 1600MHz
Full duplex

 
533MHz Front Side Bus
Half duplex
         
Integrated Memory Controller (MCT)
 

Yes, 64-bit + 8-bit ECC, supports
PC3200, PC2700, PC2100, or PC1600 so-DIMMs

 
No, Discrete logic device in chipset
         
Total Processor-to-system Bandwidth
 
System: up to 6.4 GB/s
Memory: up to 3.2 GB/s
Total: up to 9.6GB/s
 
Total: up to 4.3 GB/s
         
Integrated Northbridge
 
Yes,
128-bit data path @ CPU core frequency
 
No,
Discrete logic device in chipset,
64-bit data path @ 133MHz
         
Advanced Power Management
 
AMD PowerNow!™ Technology
 
Enhanced Intel SpeedStep technology
         
Enhanced Virus Protection Capability*
 
Yes
 
Execute Disable Bit**
         
Wireless Compatibility
 
802.11a, b, and g
 
802.11a, b, and g
         
3D and Multimedia Instructions
 
3DNow! ™ Professional technology, SSE2, SSE3
 
SSE, SSE2
         
Process Technology
 
90 nanometer, SOI (silicon-on-insulator) technology
 
90 nanometer
         
Packaging
 
754-pin lidless micro- PGA
 
Socket 478, micro- PGA
         
Thermal Design Power
 
25W, 35W
 
27W
 

*Enhanced Virus Protection will by default only protect the user's Windows operating system. Users must, at installation of Microsoft Windows® XP  Service Pack 2 or when they first purchase their systems, enable the protection of  their applications and associated files or they will not be protected from memory buffer overrun attacks. Advanced Micro Devices, inc. and Microsoft strongly recommend that users install and regularly update third party anti-virus software as part of their security strategy.

** Not available on all processors

 




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