AMD Opteron™ 3200 Series Processor Features

FEATURE	FUNCTION
New AMD Opteron™ Core Architecture	Optimized performance per watt: Full performance from each core High frequency and low-power design Virtualization enhancements Shared double-sized floating point unit (FPU) ISA enhancements
AMD Turbo CORE Technology	Turns unused TDP headroom into added clock speed for improved performance
ISA Enhancements	In addition to baseline instruction support, added SSE4.1, SSE4.2, SSSE3, AVX, AES, PCLMULQDQ, FMA4 and XOP
Flex FP	The world’s only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module.

FEATURE	FUNCTION
TDP Power Cap	Allows the user to set the maximum processor power ceiling via BIOS or APML
C6 Power State	Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core.
APML (Advanced Platform Management Link)	Provides an interface for processor and system management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor
AMD CoolSpeed Technology	Provides highly accurate thermal information and thermal protection
C1E	Reduces memory controller and HyperTransport™ technology links’ power
LV-DDR3 Support	Now supports DDR3 at 1.25V in addition to 1.35V
UDIMM Support	Support for ECC UDIMM memory
Higher DDR3 Frequencies	DDR3-1866 MHz now supported only with a single physical DIMM per memory channel

FEATURE	FUNCTION
HyperTransport™ 3.0 Technology (HT3)	Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 5.2GT/s with HT3
Cache and Core Count	4 or 8 cores within the same package Up to 8 MB L2 Cache (1MB per core) Up to 8 MB L3 Cache (per processor)