| Next generation modular core architecture |
Optimized performance per watt:
- High frequency and low-power design
- Virtualization enhancements
- Shared double-sized Flex FP
- IPC enhancements
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The new processor core can help enhance power efficiency for server products:
- Help minimize cooling solution complexities.
- Help reduce power at low utilization.
- Enable more control for IT managers.
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| AMD Turbo CORE Technology |
Turns unused TDP headroom into added clock speed for improved performance. |
Additional performance when your application demands it. |
| Flex FP |
The world’s only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module. |
Enhances flexibility and performance in technical computing. |
| High DDR3 Frequencies |
DDR3-1866 MHz support |
Outstanding performance for memory intensive applications |
| AMDP2.0 |
TDP Power Cap |
Allows the user to set the maximum processor power ceiling via BIOS or APML |
This technology gives enterprises the ability to customize their chips to meet power and workload demands, providing:
- More control over power settings
- Flexibility to set power limits without capping CPU frequencies
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| C6 Power State |
Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core. |
Helps reduce power consumption when servers are in idle.
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| APML (Advanced Platform Management Link) |
Provides an interface for processor and system management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor. |
Remote Power Management Interface (RPMI) in:
- Ability to monitor and control platform power consumption via p-state limits
- Access to processor identification and health
Precision Thermal Monitor:
- Provides accurate information about CPU thermals to closely monitor power/cooling and proactively alert the Base Management Controller (BMC)
- Early notification helps save time and money by providing intelligence that can be used to more effectively monitor power and thermals to optimize cooling solutions in an IT datacenter
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| AMD CoolSpeed Technology |
Provides highly accurate thermal information and thermal protection. |
- Server can automatically drop into lower power mode if processor’s thermal environment exceeds safe operational limits
- Offers platform providers the ability to safely reduce system fan speeds, which helps deliver greater platform efficiency
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| C1E |
Reduces memory controller and HyperTransport™ technology links’ power. |
This feature can equate to a significant power savings in your datacenter depending on system configuration, when the Northbridge and HyperTransport™ technology links are powered down and cores are at idle. |
| UDIMM Support |
Support for ECC UDIMM memory |
Provide more memory support options to allow IT Managers to pick the right memory for their budget. |
| Direct Connect Architecture 2.0 |
HyperTransport™ 3.0 Technology (HT3) |
Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 5.2GT/s with HT3. |
Helps improve overall system balance and scalability. |
| Cache and Core Count |
- 4 or 8 cores within the same package
- Up to 8 MB L2 Cache (1MB per core)
- Up to 8 MB L3 Cache (per processor)
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Offers outstanding performance and performance/watt for multi-threaded environments like virtualization, database and web serving. |