| Second generation of AMD's modular core architecture – codenamed "Piledriver" |
- Higher performance and higher performance/watt than the previous generation
- Same power bands and power saving features
- Socket compatible
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- Low TCO with better performance1 and price/performance
- Runs applications faster1 within the same power budget
- Helps extend life of investment by leveraging current socket platforms
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| Cache and Core Count |
Up to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket. |
Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving. |
| Higher DDR3 Frequencies |
Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations. |
Helps improve system performance. |
| Quad Channel Memory |
Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM. |
Can increase performance, especially in memory-intensive workloads. |
| AMD Turbo CORE Technology |
Cores can boost performance by up to 300MHz simultaneously when headroom is available. |
Adds clock speed for improved performance. |
| AES Instructions |
Provides hardware acceleration for fast and secure data encryption and decryption. |
Helps improve application performance. |
| TDP Power Cap |
Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack. |
Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies. |
| C6 Power State |
Core power gating reduces and increases voltage as needed. |
Helps reduce power costs during times of low usage. |