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|  | MCP Product Brief | | | MCP Ordering Part Numbers | | | Features & Benefits | | 1.8V MCP Devices | |  | Am41PDS3224D | | | Am41PDS3228D | | | Am42BDS6408G | | | Am42BDS6408H | | | Am42BDS640AG | | | Am49BDS640AH | | Top or Bottom Boot | | | Am41DL16x4D (16Mb, x8/x16) | | | Am41DL32x4G (32Mb, x8/x16) | | | Am41DL32x8G (32Mb, x8/x16) | | | Am41DL6408G (64Mb, x8/x16) | | | Am41DL6408H (64MB, x8/x16) | | | Am41LV3204M (32Mb, x8/x16) | | | Am42DL16x2D (16Mb, x8/x16) | | | Am42DL16x4D (16Mb, x8/x16) | | | Am42DL32x4G (32Mb, x8/x16) | | | Am42DL640AG (64Mb, x8/x16) | | | Am42DL640AH (64Mb, x8/x16) | | | Am42DL6402G (64Mb, x8/x16) | | | Am42DL6404G (64Mb, x8/x16) | | | Am45DL32x8G (32Mb x8/x16) | | | Am45DL3208G (32Mb,x8/x16) | | | Am45DL6408G (64Mb, x8/x16) | | | Am49DL32xBG (32Mb, x8/x16) | | | Am49DL320BG (32Mb, x8/x16) | | | Am49DL3208G (32Mb, x16) | | | Am49DL6408H (64Mb, x16) | | | Am49DL640AG (64MB, x8/x16) | | | Am49DL640BG (64Mb, x8/x16) | | | Am49DL640BH (64Mb, x8/x16, 32Mb, x16) | | | Am49LV6408M (64Mb, x16, 8Mb, x16) | | | Am49PDL127AH/ Am49PDL129AH (128Mb, x16) | | | Am49PDL127BH/ Am49PDL129BH (128Mb, x16, 32Mb, x16) | | | Am49PDL640AG (64Mb, 4M x16-Bit) | | | Am49DL640AH (64Mb, x8/x16) | | | Am49LV128BM (128Mb, x16/x8) | | | Am50DL9608G | | | Am50DL128BG (2 x 64Mb, x8/x16) | | | Am50DL128BH (2x 64Mb, x8/x16) | | | Am50DL128CG (2 x 64Mb, x8/x16) | | | Am50DL128CH (2x 64Mb, x16) | | | Am70PDL127BDH/ Am70PDL129BDH (64Mb, x16, 128Mb, x16, 32Mb, x16) | | | Am75DL9608HG (64Mb, x16, 32Mb, x16) | | | Am70PDL127CDH/ Am70PDL129CDH (64Mb, x16, 128Mb, x16) | | | S70JL128H(8Mx8-Bit/4Mx16-Bit) | | | S71PL129JC0/JB0/JA0 | | | S71PLxxxJ |
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Multi-Chip Package (MCP) Flash and SRAM Solutions
Overview
The industry-leading family of Spansion™ multi-chip package (MCP) Flash and SRAM memory solutions are now available from Spansion.
Utilizing a single, convenient package including high-performance Spansion Flash and the highest quality SRAM, MCP solutions
offer customers the ability to design feature-rich applications while optimizing board space in today’s cutting-edge systems. Over twenty million
MCP devices have been flawlessly manufactured and shipped to date. The high-performance, ultra-low power consumption, and unmatched reliability
of proven Spansion MCP devices make them a perfect solution for designers and manufacturers everywhere.
Upcoming device families Am45, Am49, and Am50 will include Spansion Flash
Memory combined with Pseudo SRAM. Pseudo SRAM uses a DRAM core with an SRAM
interface, allowing for cost reduced SRAM solutions. This makes Flash and
PSRAM MCP devices a perfect solution for high density RAM applications.
In addition, due to the long term supply of PSRAM as compared to DRAM, it
is an ideal replacement for DRAM in-system.
Future Spansion MCP devices will feature alternative Flash
devices, higher densities, additional packaging options, and new MCP combinations
(e.g. Flash + ASIC, Flash + ASIC + SRAM, Flash + Flash, etc.) to meet
any design specification.
Small Footprint, Consistent Packaging
Cellular
handset designers and other leading manufacturers face many challenges
providing the latest features in decreasing footprints. Spansion MCP devices meet
these challenges by offering a single, space-saving package with the industry-leading
performance and quality that customers have come to expect from Spansion products.
Because the various Spansion MCP solutions are stacked
in a consistent footprint and pinout, customers can easily design a single-board
while differentiating their products. In addition, the advanced stacking technology utilized can readily be applied to new Flash, SRAM, or other devices
as they are introduced. Consequently, Spansion MCP products will continue to offer customers
the most value-added and cost-effective MCP solutions as innovations enter
the marketplace.
Streamline Your Supply Chain, Focus On Your Designs
Our strong partnerships with leading manufacturers
not only result in a reliable supply of SRAM for MCP devices, but also
ensure that customers can benefit from any cost reductions or advances
in SRAM technology. Additionally, Spanion manages the complex logistics, quality,
and inventory management issues in procuring the best SRAM available,
thereby enabling customers to streamline their supply chain and focus
on creating great products. Finally, our award-winning customer service and demonstrated commitment to customer success make Spansion MCP solutions an
ideal choice for most portable applications.
Applications
Spansion MCP solutions are ideal for a variety of applications requiring
high performance, low power consumption, and a small footprint:
- Wireless Modems
- Cellular Handsets
- Two-Way Pagers
- Personal Information Devices
- Handheld PCs
- GPS Receivers
- Wearable Computers
Ordering Information
| Product |
Flash Density
(Data Width) |
SRAM Density
(Data Width) |
Speed Ratings (ns)
|
Package Options
|
| Am41DL16x4DT/B |
16 Mb (x8/x16) |
4 Mb (x8/x16) |
70, 85 |
69-ball FBGA |
| Am41DL3208G |
32 Mb (x8/x16) |
8 Mb (x8/x16) |
70, 85 |
73-ball FBGA |
| Am41DL32x4GT/B |
32 Mb (x8/x16) |
4 Mb (x8/x16) |
70, 85 |
73-ball FBGA |
| Am41DL32x8GT/B |
32 Mb (x8/x16) |
8 Mb (x8/x16) |
70, 85 |
73-ball FBGA |
| Am41DL6408G |
64 Mb (x8/x16) |
8 Mb (x8/x16) |
70, 85 |
73-ball FBGA |
| Am41PDS3224D |
32 Mb (x16) |
4 Mb (x8/x16) |
100,110 Flash; 70 SRAM
|
73-ball FBGA |
| Am41PDS3228D |
32 Mb (x16) |
8 Mb (x8/x16) |
100, 110 Flash; 70 SRAM
|
73-ball FBGA |
| Am42DL16x2DT/B |
16 Mb (x8/x16) |
2 Mb (x16) |
70, 85 |
69-ball FBGA |
| Am42DL16X4D |
16 Mb (x8/x16) |
4 Mb (x16) |
70, 85 |
69-ball FBGA |
| Am42DL6404G |
64 Mb (x8/x16) |
4 Mb (x16) |
70, 85 |
73-ball FBGA |
| Am42DL640AG |
64 Mb (x8/x16) |
16 Mb (x16) |
70, 85 |
73-ball FBGA |
| Am42BDS6408G |
64 Mb (x16) |
8Mb (x16) |
70, 85 |
93-ball FBGA |
| Am42BDS640AG |
64 Mb (x16) |
16Mb (x16) |
70, 85 |
93-ball FBGA |
| Am45DL6408G |
64 Mb (x8/x16) |
8 Mb (x8/x16) PSRAM
|
70, 85 |
73-ball FBGA |
| Am49DL640BG |
64 Mb (x8/x16) |
32 Mb (x8/x16) PSRAM
|
70, 85 |
73-ball FBGA |
| Am50DL128BG |
Two stacked 64 Mb (x8/x16)
|
32 Mb (x16/x16) PSRAM
|
70, 85 |
73-ball FBGA |
*Available in Top (T) or Bottom (B) Boot sector configurations
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