Technologies
MirrorBit™
Architectures
Standard
Burst/Page
MCP Flash and SRAM
Simultaneous Read/Write
Advanced (Burst/Page+Simult. R/W)
Voltages & Densities
1.8V Devices
3.0V Devices
5.0V Devices
Density Families
General Information
Events & Tradeshows
Flash Memory News
Ordering Part Numbers
Legacy
Spansion
OPN Conversion Tool
Technical Documentation
Success Story
Ask AMD Knowledge Base
Spansion Overview
www.spansion.com
Resources for:
Investors
Job Seekers
Press

Density Families
32 Mbit
1.8V Devices
Am29DS323D
Am29DS320G
Am29DS32xG
Am29BDS320G
Am29BDS323D
Am29PDS322D
Am41PDS3224D
Am41PDS3228D
S29NSxxxJ
Am29LV033C
Am29LV320D
Am29PL320D
3.0V Devices
Am29DL320G
Am29DL32x
Am29DL32xG
Am29LV033MU
Am29LV320MT/B
Am29LV320MH/L
Am41DL32x4G
Am41DL32x8G
Am41LV3204M
Am45DL32x8G
Am45DL3208G
Am49DL32xBG
Am49DL320BG
Am49DL3208G
S29AL032D Product Overview
S29GL032M
S29PL032J
S29JL032H
S71PL032J
5.0V Devices
Am29F032B

32 Mbit Density Devices

Spansion offers several Flash memory devices at the 32 Mbit density level, for 1.8V, 3.0V, and 5.0V operating ranges. The products include a choice of boot or uniform sector organizations, and an 8-bit or 16-bit bus width. Devices are available with the standard, Burst mode, Page mode, or simultaneous read/write architecture. The 32 Mbit Page mode device (Am29PL320) is the first Flash memory from Spansion with a 32-bit data bus. Spansion 32 Mb devices are offered in variety of packages, including TSOP, SO, and FBGA.

For systems that require both Flash and SRAM in a space saving form factor, Spansion offers combinations of 32Mb Flash and SRAM in a single package, and thereby allows customers to offer high performance products.

Seamless migration paths to the next density level often eliminate the need for system redesigns. Spansion offers a wide range of Flash memory solutions and provides high reliability, superior performance, and award-winning customer service.

**Compatible with 5.0 Volt Equivalents
  1. Migration may be to either/any indicated device
  2. 40 to 48 pin migration
  3. 48 to 63 ball migration
  4. 3 pin change
  5. 1 pin change
  6. 1 pin change from LV400 to DL400
  7. 44 to 56 pin migration, 1 pin requires reroute to opposite side of package



©2009 Advanced Micro Devices, Inc.    |    Contact AMD    |    Careers    |    RSS Feeds    |    Terms and Conditions    |    Privacy    |    Trademark information    |    Site Map