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|  | MCP Product Brief | | | MCP Ordering Part Numbers | | | Features & Benefits | | 1.8V MCP Devices | |  | Am41PDS3224D | | | Am41PDS3228D | | | Am42BDS6408G | | | Am42BDS6408H | | | Am42BDS640AG | | | Am49BDS640AH | | Top or Bottom Boot | | | Am41DL16x4D (16Mb, x8/x16) | | | Am41DL32x4G (32Mb, x8/x16) | | | Am41DL32x8G (32Mb, x8/x16) | | | Am41DL6408G (64Mb, x8/x16) | | | Am41DL6408H (64MB, x8/x16) | | | Am41LV3204M (32Mb, x8/x16) | | | Am42DL16x2D (16Mb, x8/x16) | | | Am42DL16x4D (16Mb, x8/x16) | | | Am42DL32x4G (32Mb, x8/x16) | | | Am42DL640AG (64Mb, x8/x16) | | | Am42DL640AH (64Mb, x8/x16) | | | Am42DL6402G (64Mb, x8/x16) | | | Am42DL6404G (64Mb, x8/x16) | | | Am45DL32x8G (32Mb x8/x16) | | | Am45DL3208G (32Mb,x8/x16) | | | Am45DL6408G (64Mb, x8/x16) | | | Am49DL32xBG (32Mb, x8/x16) | | | Am49DL320BG (32Mb, x8/x16) | | | Am49DL3208G (32Mb, x16) | | | Am49DL6408H (64Mb, x16) | | | Am49DL640AG (64MB, x8/x16) | | | Am49DL640BG (64Mb, x8/x16) | | | Am49DL640BH (64Mb, x8/x16, 32Mb, x16) | | | Am49LV6408M (64Mb, x16, 8Mb, x16) | | | Am49PDL127AH/ Am49PDL129AH (128Mb, x16) | | | Am49PDL127BH/ Am49PDL129BH (128Mb, x16, 32Mb, x16) | | | Am49PDL640AG (64Mb, 4M x16-Bit) | | | Am49DL640AH (64Mb, x8/x16) | | | Am49LV128BM (128Mb, x16/x8) | | | Am50DL9608G | | | Am50DL128BG (2 x 64Mb, x8/x16) | | | Am50DL128BH (2x 64Mb, x8/x16) | | | Am50DL128CG (2 x 64Mb, x8/x16) | | | Am50DL128CH (2x 64Mb, x16) | | | Am70PDL127BDH/ Am70PDL129BDH (64Mb, x16, 128Mb, x16, 32Mb, x16) | | | Am75DL9608HG (64Mb, x16, 32Mb, x16) | | | Am70PDL127CDH/ Am70PDL129CDH (64Mb, x16, 128Mb, x16) | | | S70JL128H(8Mx8-Bit/4Mx16-Bit) | | | S71PL129JC0/JB0/JA0 | | | S71PLxxxJ |
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Multi-Chip Package (MCP) Flash Memory Devices - Features and Benefits
| Features |
Benefits |
| Industry-leading, high-performance Flash Memory |
Empowers designers to create feature-rich systems and applications |
| Ultra-low power consumption |
Extends system usage time for battery-operated applications |
| Spansion Flash and high quality SRAM in a single package |
Reduces design footprints and product form-factors; simplifies manufacturing and cuts costs by reducing PCB requirements; streamlines supply-chains and simplifies inventory-management |
| Consistent packaging and pinouts |
Simplifies design by allowing for product specialization from a single board design; easy migration to new and future cost-reduced MPC solutions |
| Strong alliances with leading SRAM manufacturers |
Reliable supply of MPC solutions; the highest-quality SRAM to satisfy any design |
| Advanced stacking technology |
New MPC devices incorporating technology advances and new device combinations |
| Meets Spansion’s uncompromising standards for reliability |
Industry-leading quality standards offer peace-of-mind for all applications |
| Simultaneous Read/Write Operation |
Read while programming with no latency; Spansion’s Data Management Software (DMS) facilitates easy storage of code and data in the same device |
| SecSi (Secured Silicon) sector |
Prevents cloning and signal theft |
| Flexible sector architecture |
Multiple bootblock options for a variety of applications |
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