Spansion offers several flash memory devices at the 4 Mbit density level, for both the 3 V and 5 V operating ranges. The products include a choice of boot or uniform sector organizations, and an 8-bit or 16-bit bus width. Devices are available with the standard or simultaneous read/write architecture. Spansion 4 Mb devices are offered in variety of packages, including TSOP, SO, PLCC, PDIP, and FBGA. Some products are also available through the Known Good Die (KGD) program, in which a flash memory die is fully tested before it is shipped from the factory. Spansion KGD flash products are guaranteed to offer the same high reliability and quality as Spansion packaged flash memory.

Seamless migration paths to the next density level often eliminate the need for system redesigns. Spansion offers a wide range of flash memory solutions and provides high reliability, superior performance, and award-winning customer service.

1. Migration may be to either/any indicated device
2. 40 to 48 pin migration
3. 48 to 63 ball migration
4. 3 pin change
5. 1 pin change
6. 1 pin change from LV400 to DL400
7. 44 to 56 pin migration, 1 pin requires reroute to opposite side of package