AMD Technical Forum & Exposition 2008

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AMD Technical Forum & Exposition 2008 - Agenda and Sessions

Audience Registration, Breakfast 6:45am - 8:00am

Opening & Keynote Speaker - VP Willis Hendley, AMD 8:00am - 9:00am

1st Session 9:00am - 10:30am Session Co-Chairs - Mr Steven Daniels & Mr I-Cheng Chen

Time	Topic	Speaker
9:00-9:30	Session 1-1 2008-17: Holistic View of the Thermal Challenges in the Next Generation of Processors*	Dr. Gamal Refai-Ahmed, AMD
9:30-9:45	Session 1-2 2008-11: Taking Diagnostics Utilities to the Next Level to Deliver GPU with Best Performance	Mr. Michael Silver, AMD
9:45-10:00	Session 1-3 2008-15: R680 Cost Down Design	Ms. Jasminka Konvalinka, AMD
10:00-10:15	Session 1-4 2008-13: View of Halogen Free in the Coming GFX Products	Mr. Rick Maxwell, AMD
10:15-10:30	Session 1-5 2008-04: Connectivity Technology For The Future Path in Graphics and Accelerated Computing	Jim Hunkins AMD and JAE

Coffee Break 10:30am - 10:50am

2nd Session 10:50am - 12:00pm Session Co-Chairs - Mr Allen Hu & Dr Mamadou Kane

Time	Topic	Speaker
10:50-11:05	Session 2-1 2008-16:Optamize Power Topology for the coming Graphics Products*	Mr. Ming Chen, AMD
11:05-11:20	Session 2-2 2008-07: Latest Thermistor Technology for Thermal Management	MuRata Electronics
11:20-11:35	Session 2-3 2008-26: Renesas Power Solution for GPU	Renesas Technology Corp
11:35-11:50	Session 2-4 2008-30: Digital Interface Between GPU and PWM Controller for VRM Power Management & Monitoring	STMicroelectronics
11:50-12:05	Session 2-5 2008-36: Cadence Allegro Silicon-PKG-Board Solutions	Cadence

Lunch Break and Exposition 12:05pm - 2:00pm

Keynote Speaker - Professor Kenneth Goodson, Stanford University 1:30pm - 2:30pm
Title: Next Wave Thermal Solutions

3rd Session 2:00pm - 4:00pm Session Co-Chairs - Mr Joe Tullo & Mr Scott Lin

Time	Topic	Speaker
2:00-2:15	Session 3-1 2008-08: Skiving Micro Channel Development	Fujikura
2:15-3:30	Session 3-2 2008-25: Stable-Flow, Two-Phase Cooling Systems	Pipeline Communications
2:30-2:45	Session 3-3 2008-35: Vapor Chamber Based Thermal Solutions for Optimized Performance, Weight and Cost	Celsia Technologies and Electronics Cooling Solutions
2:45-3:00	Session 3-4 2008-19: The Influence of Chinese Labor Law, Energy and Reaching the Mature Development of the South & East Side of China on the Cost of the Consumer Products	Novark Technology and AMD
3:00-3:15	Session 3-5 2008-05: Development of a Robust CPU/GPU Single Loop Liquid Cooler	AVC
3:15-3:30	Session 3-6 2008-05: Open-Cell Metal Foams for Electronic Cooling	Auras and Metafoam

Coffee Break 3:45pm - 4:05pm

4th Session 4:05pm - 5:20pm Session Chairs - Mr Ming Cheng & Mr Rick Maxwell

Time	Topic	Speaker
4:05-4:20	Session 4-1 2008-11: Forward Looking to GPU in Mobile Products *	Mr. I-Cheng Chen, AMD
4:20-4:35	Session 4-2 2008-40: Thermal Trends in Memory Devices	Hynix Semiconductor
4:35-4:50	Session 4-3 2008-29: Advanced Memory Technology in Graphic Applications	Samsung
4:50-5:05	Session 4-4 2008-11: Best Practice for the Optimum EMI Design	Dr. Mamadou Kane, AMD
5:05-5:20	Session 4-5 2008-02: Acoustic Performance Improvement for Graphics Processors	National Semiconductor

Closing Exhibit & Distribution of Gifts and collecting Survey 5:20pm - 5:35pm

* It is not listed in the USB Key