Production of the AMD Athlon is planned to begin at Fab 30 in Q4 1999.

• Fab 30 will be the first European wafer fabrication facility to use copper interconnect technology in its production process.
• The copper process technology used in Fab 30 was acquired through AMD's strategic alliance with Motorola's Semiconductor Products Sector. Under this agreement, Motorola has licensed its current copper interconnect technology and High Performance Logic Process (HiPerMOS) to AMD. The companies will collaborate on the development of future logic process technology platforms featuring copper interconnects.
• AMD announced the Fab 30 project in December 1995, and ground breaking occurred ten months later. Over all, AMD's investment in Dresden totals approximately US$1.9 billion.
• In addition to Fab 30, AMD Saxony Manufacturing GmbH has established the Dresden Design Center (DDC). The DDC is planned to become a world-class integrated circuit (IC) development center. Its initial projects are in the areas of wired and wireless communications systems. The DDC has the systems and silicon design capability to bring products from concept to market.
• AMD Saxony Manufacturing GmbH plans to hire approximately 1800 employees. Two hundred of these employees will work in the Dresden Design Center. Currently (August 1, 1999), AMD has approximately 830 German and 30 American employees on board.
• Fab 30 Project Timeline



	Date	Action
	December 1995	AMD announces its Dresden project
	October 1996	Ground breaking for facility
	May 1997	Cornerstone ceremony
	September 1997	Topping off ceremony
	May 1998	Clean room ready for equipment
	November 1998	Start of First Silicon
	December 1998	First yielding SRAMs
	January 1999	First yielding AMD-K6® family processors
	Q1 1999	Begin installation of copper tools
	Q2 99	Start of first copper lots (AMD-K6 family processors)
	Planned for Q4 99	Start of AMD Athlon processor production

• Fab 30 Design/Technical Information



	Architectural design				Dr. Alfonso Mercurio ? AMA Group
	Project responsibility				Clean room and clean facilities: Meissner + Wurst
	Design partner				Achammer Tritthart Partner (ATP)
	Facility Size
				Total project	Approximately 866,000 square feet
	SMIF Clean Room
			Size		Approximately 90,000 square feet
			Category		Class 100T (100 @ 0.3m )
	Wafer Size				200 mm (8 inch)
	Technology Limit				Below 0.13m
	Copper Startup Technology				0.18m , 6 level Cu
	Fab Capacity				5,000 8-inch wafers per week at full build out
	Air
			Clean Room		Class 100T
			Mini Environment		< 0.01 class at 0.1m
	Water				< 1 ppb
	Chemical				< 1 ppb
	Gases				< 1 ppb
	Vibration
			Photo		< 200 micro-in/sec.
			Other		< 500 micro-in/sec.