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Collaborating for Success
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AMD also employs a highly collaborative approach to research and development, forging long-term alliances with leading industry partners.
IBM
AMD and IBM reached an agreement on Dec. 28, 2002, to jointly develop leading-edge process technologies for future high-performance microprocessors. The companies have extended the agreement twice, while also expanding its scope. First, in September 2004 the agreement was extended an additional three years, to include development of technologies through 2008 and the 32nm node. In November 2005, the companies agreed to extend the agreement through 2011 and the 22nm node, and recently also expanded the agreement to include early-stage exploratory research.
AMD Testing Functional Devices Made Using Extreme Ultra-Violet (EUV) Lithography on Test Chip
AMD, working together with IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip.
Read Press Release
INVENT
AMD and IBM, along with other industry leaders, also participate in the International Venture for Nanolithography (INVENT) alliance, a research, education and economic development initiative at Albany NanoTech, one of the world’s leading centers for nanotechnology R&D, located at the State University of New York in Albany, New York. INVENT is the largest public-private partnership to develop and deploy nanolithography solutions, including immersion 193nm and Extreme Ultraviolet (EUV) lithography.
Advanced Mask Technology Center (AMTC)
To stay on the leading edge of mask technology research, development and production, AMD, Toppan Photomasks Inc. (formerly DuPont Photomasks) and Infineon Technologies AG jointly funded, built and operate the Advanced Mask Technology Center located just minutes away from AMD’s Dresden facility.
Center for Nanoelectronic Technology
In May 2005, partners AMD, Infineon, and Fraunhofer-Gesellschaft celebrated the opening of the Center for Nanoelectronic Technology (CNT) in Dresden, Germany. Priorities include the research and development of selected process steps for the manufacture of high-density memory components, as well as high-performance transistors and other high-performance elements for microprocessors.
Production Partnerships
Through agreements with Chartered Semiconductor Manufacturing, TSMC and UMC, AMD has the operational flexibility to add manufacturing capacity as needed.
Chartered
In June 2006, AMD began its first revenue shipments of AMD64 microprocessors manufactured at Chartered Semiconductor Manufacturing. Chartered licenses AMD’s patented APM technology, which allows the company’s fabs to operate as an extension of AMD fabs. Chartered will begin 65nm production of AMD processors in 2007.
TSMC
AMD and TSMC collaborate closely to deliver premium graphic products to the market. The relationship began in 1998 and is characterized by close collaboration. The sharing of test data, research results and design ideas between AMD design engineers and TSMC process technology engineers enables the introduction of leading technology at high yields on bulk silicon.
UMC
Since 1995, UMC has played a key role in AMD’s management of an increasingly diverse production environment. UMC nimbly introduces and modulates production of a large number of AMD chipset and graphics products.
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