"At only 30 percent the size of a standard TSOP flash chip, AMD's FBGA package provides portable system designers with the ability to reduce the size of their product or integrate more features," said Walid Maghribi, group vice president of AMD's Memory Group. "The 0.8mm ball pitch is easy for customers to use with today's personal computer board technology and allows AMD to continue to implement cost reductions without changing the electrical footprint of the package."

"Our new 1.8-volt-only device was developed in concert with our customers' future product plans and represents a milestone in AMD's drive to ever-lower voltages," Maghribi continued. "Eventually, digital cellular phones will be capable of providing one month of standby time as is common with pagers today. In addition, our higher density 1.8-volt-only devices will make possible entirely new types of cellular phone designs, further shrinking size and increasing functionality."

About FBGA

FBGA packages are constructed in a similar manner to conventional TSOP and BGA packages, using existing equipment and proven manufacturing processes. Because the die is attached to a flexible substrate, the package size is determined by the dimensions of the substrate rather than the dimensions of the die. Any die that is smaller than the package cavity can still be assembled in the FBGA package. This allows the package dimensions and electrical footprint to remain fixed as smaller, cost reduced die are put into production or as customers migrate between densities.

FBGA Advantages

The FBGA package has three major advantages over strictly die-sized packages:

• With FBGA packages, system manufacturers will never have the expense of re-laying out a board, retooling a programmer or revising an assembly line because of an AMD die revision. Manufacturing equipment, assembly processes, and documentation remain unchanged, guaranteeing OEMs an uninterrupted manufacturing ramp on existing production lines. Since FBGA products do not become obsolete due to die changes, replacement parts will be available for field service maintenance and repair.
• Die-sized packages lack the necessary die area to place a useable ball grid array for lower density flash memories. Today, FBGA is the only feasible CSP solution for flash memories below 8Mb. As 0.25-micron devices go into production, FBGA packaging is expected to be the only viable CSP alternative for 8Mb devices as well.
• Since die revisions do not require package requalifications or costly retooling of handling and testing equipment by the manufacturer, the FBGA is a more cost-effective CSP solution.

AMD's 8Mb devices are packaged in a 6x9mm FBGA with ball pitch of 0.8mm., while the 16Mb flash is slightly larger at 8x9mm. Since AMD's flash die are considerably smaller than competitive offerings, FBGA packages offer the smallest form factor CSP solution, even smaller than competitive devices in mBGA packaging. In addition, substrate-based packages allow all AMD flash devices, regardless of density, to have a common 0.8mm. pitch electrical footprint and therefore, to be interchangeable.

Availability

AMD will offer a full family of FBGA devices, ranging from 4Mb to 32Mb, in its low-voltage flash families. Production deliveries will begin in Q1 1998.

Package, Price, Availability

The Am29SL800 is available now in a 48-pin TSOP and a 48-ball Fine Pitch BGA (FBGA). FBGA provides the smallest, least expensive package solution for flash memory. The Am29SL800-170EI, industrial temperature range, is $8.70 in 10,000-piece quantities. The Am29SL800-170EC, commercial temperature range, is $8.35 in 10,000-piece quantities. The 1.8-volt family is offered at a 20 percent price premium over the 2.7-volt family.

Safe Harbor Statement

The forward-looking statements in this release with respect to new product offerings are subject to risks and uncertainties, and actual results may differ from those currently expected. Such risks and uncertainties include the impact of competitive products and pricing, the timely development of wafer fabrication process technologies, the effect of changing economic conditions, and such risks and uncertainties detailed from time-to-time in the company's SEC reports.