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Mobile AMD Sempron™ Processor Product Comparison
Mobile AMD Sempron™ Processor for Thin and Light Mobile PCs Product Comparison

Mobile AMD Sempron™ Processor
Model Number
Frequency
L2 Cache

3300+
3100+

2.0 GHz
1.8 GHz

128KB
256KB

3000+
1.8 GHz
128KB
2800+
1.6 Ghz
256KB
2600+
1.6 Ghz
128KB


Features
      
Mobile AMD Sempron™ Processor
     
Intel Celeron M
Architecture Introduction
 
2003
 
2003
         
On-chip L1 Cache
(Instruction + Data)
 
128KB (64KB + 64KB)
 
64KB (32KB + 32KB)
         
On-chip L2 Cache
 
256KB/128KB (exclusive)
Total Effective Cache:
384KB/256KB
 
1 MB (Inclusive)
Total Effective Cache: 1MB
         
System Bus Technology
 

One 16/16-bit link @ up to 1600MHz Full duplex

 
400MHz Front Side Bus
Half duplex
         
Integrated DDR Memory Controller (MCT)
 

Yes, 64-bit + 8-bit ECC
PC3200, PC2700, PC2100, or
PC1600 so-DIMMs

 
No, discrete logic device on motherboard
         
Total Processor-to-system Bandwidth
 
System Bus: up to 6.4 GB/s
Memory Controller: up to 3.2 GB/s
Total: up to 9.6GB/s
 
Total: up to 3.2 GB/s
         
Integrated Northbridge
 
Yes,
128-bit data path @ CPU core frequency
 
No,
discrete logic device on motherboard,
64-bit data path @ 100MHz
         
Advanced Power Management  
AMD PowerNow!™ Technology
Only sleep states supported
   
Enhanced Virus Protection Capability*  
Yes, enabled by
Windows® XP SP2
No
   
Wireless Compatibility  
802.11a, b, and g
802.11a, b, and g
   
3D and Multimedia Instructions  
3DNow!™ Professional
technology, SSE2
SSE, SSE2
   
Process Technology  
90 nanometer, SOI (silicon-on-insulator) technology
90 nanometer
   
Packaging  
754-pin lidless μPGA
Socket 478, μFCPGA
   
Thermal Design Power  
25W
21W


Mobile AMD Sempron™ Processor for Full Size Mobile PCs Product Comparison

AMD Sempron Processor
Model Number
Frequency
L2 Cache
3400+
2.2 GHz
256KB
3300+
2.0 GHz
128KB
3100+
1.8 Ghz
256KB
3000+
1.8 Ghz
128KB
2800+
1.6 Ghz
256KB
2600+
1.6 Ghz
128KB


Features
      
Mobile AMD Sempron™ Processor
     
Intel Celeron® D
Architecture Introduction
 
2003
 
2003
         
On-chip L1 Cache
(Instruction + Data)
 
128KB (64KB + 64KB)
 
L1: 12K mop trace + 16KB data
         
On-chip L2 Cache
 
256KB/128KB (exclusive)
Total Effective Cache:
384KB/256KB
 
256KB (Inclusive)
Total Effective Cache: 256KB
         
System Bus Technology
 

One 16/16-bit link @ up to
1600MHz Full duplex

 
533MHz Front Side Bus Half duplex
         
Integrated DDR Memory
Controller (MCT)
 

Yes, 64-bit + 8-bit ECC
PC3200, PC2700, PC2100, or
PC1600 so-DIMMs

 
No, discrete logic
device on motherboard
         
Total Processor-to-system Bandwidth
 
System Bus: up to 6.4 GB/s
Memory Controller: up to 3.2 GB/s
Total: up to 9.6GB/s
 
Total: up to 4.3 GB/s
         
Integrated Northbridge
 
Yes,
128-bit data path @ CPU core frequency
 
No,
discrete logic device on motherboard,
64-bit data path @ 133MHz
         
Advanced Power Management  
AMD PowerNow!™ Technology
No
   
Enhanced Virus Protection Capability  
Yes, enabled by
Windows ® XP SP2
Yes, enabled by Windows® XP SP2 (Not available on Socket 478 µFCPGA Packaging)
   
Wireless Compatibility  
802.11a, b, and g
802.11a, b, and g
   
3D and Multimedia Instructions  
3DNow!™ Professional
technology, SSE, SSE2
SSE, SSE2, SSE3
   
Process Technology  
90 nanometer,
SOI (silicon-on-insulator) technology
90 nanometer
   
Packaging  
754-pin lidless μPGA
Socket 478, μFCPGA or LGA775
   
Thermal Design Power  
62W
8473W (KGA 775
73W Socket 478 μFCPGA)

* Enhanced Virus Protection (EVP) is only enabled by certain operating systems, including the current versions of Microsoft® Windows®, Linux, Solaris, and BSD Unix. After properly installing the appropriate operating system release, users must enable the protection of their applications and associated files from buffer overrun attacks. Consult your OS documentation for information on enabling




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