Broadcom Launches Next Generation of Server I/O Controllers Featuring a Modular Architecture for Platform Scalability

New HT-2100 Server I/O Platform Solution Now Available in Next-Generation AMD Opteron™ processor-based Servers from World’s Leading Server OEMs

IRVINE, Calif. -- 8/15/2006 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today introduced its second generation of server I/O controller silicon based on HyperTransport® technology. The new Broadcom® controller features a modular architecture for platform scalability, enabling server OEM customers to optimally configure their servers for specific market segments while achieving better energy efficiencies, lower system costs and faster time-to-market. Broadcom’s modular approach to server chipset architecture provides server OEMs with the freedom to choose the appropriate I/O and feature set for today’s mainstream multi-socket servers, server towers and blade server designs.

Broadcom’s flexible server I/O architecture enables OEMs to manage the cost structure of their server systems and customize feature sets best suited for each particular server market segment. The scalable architecture also enables OEMs to expand beyond the dual-socket segment into multi-socket product segments while leveraging the existing enterprise-class architecture. Therefore, end users can now take advantage of server-class reliability, availability and serviceability (RAS) features regardless of the server segment. These same RAS features that have become standard in the 4-way and above server segment is now available to the 2-way volume server market.

A server I/O controller chip acts as the interface from processor(s) to other I/O protocols, such as PCI-Express® (via the open standard HyperTransport bus technology) to facilitate data transmission in a server system. Announced today is the Broadcom HT-2100 server I/O controller chip and platform solution designed to solve cost and usability issues for server OEMs. The modular architecture of the HT-2100 controller enables server OEMs to use the same chipset family and software for multiple server markets, requiring minimal changes. By leveraging Broadcom’s industry-leading, field proven I/O technology and expertise, the new server I/O controller demonstrates Broadcom’s commitment in providing flexible, reliable and scalable server I/O products with the best mix of performance, power consumption and cost-effectiveness.

“AMD applauds Broadcom on the launch of its second generation HyperTransport technology-based server I/O solution,” said Pat Patla, Director, Server/Workstation Marketing, AMD (NYSE: AMD). “By supporting Next-Generation AMD Opteron™ processors and leveraging AMD’s revolutionary Direct Connect Architecture, Broadcom demonstrates its ability to deliver robust I/O platform solutions to server OEM customers. We look forward to continuing our close collaboration with Broadcom.”

“By integrating Broadcom's second generation server I/O controllers based on HyperTransport technology in our servers and server blades, we are able to deliver leading innovation and a balanced system architecture that our customers have come to rely on,” said Paul Miller, vice president, marketing, Industry Standard Servers and BladeSystem, HP. “HP’s comprehensive ProLiant and BladeSystem Opteron-based server portfolio gives customers the most choice and functionality at competitive price points.”

“We are pleased to continue our relationship with Broadcom for our new IBM System x and BladeCenter servers based on Next-Generation AMD Opteron processors,” said Kelvin Hawkins, director of hardware development, IBM System x. “IBM’s collaboration with Broadcom has enabled time-to-market delivery of highly-validated and robust IBM systems based on Broadcom’s entire portfolio of chipset platform solutions.”

“Broadcom’s flexible architecture allows TYAN to come up with multiple server designs that leverage the same I/O resources, enabling faster time to market while still allowing for product differentiation,” said Danny Hsu, Vice-President of Sales and Marketing at TYAN Computer Corp.

The HT-2100 server I/O controller features a high performance HyperTransport to PCI-Express bridge that is capable of tunneling data between two HyperTransport ports. The HT-2100 also features 1 GHz HyperTransport technology, 24 lanes of PCI-Express and a HyperTransport tunnel to provide the speed and bandwidth required for next generation I/O protocols.

“Broadcom’s HT-2100 controller continues our philosophy of providing modular, flexible and scalable I/O solutions that leverage existing designs and future-proof platform designs,” said Wei-Ai Tai, Director of Marketing for Broadcom’s Server I/O Line of Business. “Our server OEM customers benefit from the extensive industry-wide validation of our products, as we strive to provide the most robust I/O solution in the server market.”

Availability and Pricing
The HT-2100 server I/O controller has been released in mass production. Pricing is available upon request.

About Broadcom
Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®. Broadcom, one of the world's largest fabless semiconductor companies with annual revenue of more than $2.5 billion, is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at http://www.broadcom.com.

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the HT-2100 server I/O controller include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; uncertainties as a result of the company's previously-disclosed ongoing review of its practices in respect of options/equity grants to employees, and the publicized more general review of option grant practices throughout the technology and other industries by public regulatory bodies, and potential changes in accounting and other practices resulting therefrom; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for server applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, subsequent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.

Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. PCI Express® is a trademark of PCI-SIG Corporation. AMD, the AMD Arrow logo, AMD Opteron, AMD PowerNow!, AMD Virtualization, AMD-V, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.