AMD Introduces 0.18 Micron Mobile AMD-K6®-III+ and Mobile AMD-K6-2+ Processors
SUNNYVALE, CA --
AMD today announced the Mobile AMD-K6®-III+ and Mobile AMD-K6-2+ processor families with speeds up to 500MHz. Hewlett-Packard Company has chosen the 475MHz Mobile AMD-K6-2+ processor to power its Pavilion N3215 notebook PC. Models are shipping immediately.
The first mobile devices to be manufactured on AMD's advanced 0.18 micron technology, these processors support a number of notable features including high-speed on-chip L2 cache, AMD's innovative PowerNow! battery saving technology and an enhanced implementation of AMD's 3DNow!™ instruction set with digital signal processing (DSP) instructions.
"AMD has had tremendous success with the previous generation of mobile AMD-K6 processors, capturing more than 65 percent market share in the U.S. retail notebook PC market, according to PC Data Inc. (February 2000), and having a number of key commercial notebook PC design wins from leading companies," said Steve Lapinski, director of product marketing for AMD's Computation Products Group. "AMD's 0.18 micron process technology is allowing us to deliver these new mobile products incorporating features that provide outstanding performance, integration and a great user experience at all system price points."
About the Mobile AMD-K6®-III+ Processor
The Mobile AMD-K6-III+ processor is targeted at high performance notebooks. Available in clock speeds of 500, 475 and 450MHz, this enhanced version replaces the Mobile AMD-K6-III-P processor. The processor has a full-speed 256Kbyte on-die, Level 2 cache, and includes support for AMD's unique TriLevel Cache™ design with optional external Level 3 cache of up to 1MB for additional performance. The Mobile AMD-K6-III+ has a 100MHz front-side bus, an enhanced implementation of AMD's 3DNow! instruction set with digital signal processing (DSP) instructions, and support for AMD's PowerNow! technology for better system battery life.
About the Mobile AMD-K6-2+ Processor
The Mobile AMD-K6-2+ processor offers exceptional performance and features for value notebook PCs. Available at 500, 475 and 450MHz, the processor incorporates 128Kbyte on-chip, Level 2 cache, support for AMD's innovative PowerNow! technology, an enhanced implementation of AMD's 3DNow! instruction set with digital signal processing (DSP) instructions, and a 100MHz front-side bus.
Both the Mobile AMD-K6-III+ and Mobile AMD-K6-2+ processors operate at a core voltage of 2.0 Volts, have an extended case temperature rating of 85 degrees Celsius, and dissipate as little as 3 Watts of power running in PowerNow! battery-saver mode of operation. The processors are available in Socket 7/Super7™ platform-compatible 321-pin Ceramic Pin Grid Array packages, and are manufactured at AMD's Fab 25 wafer fabrication facility in Austin, TX.
About PowerNow! Technology
Developed by AMD, PowerNow! technology enables high-performance and extended battery life in the same system. PowerNow! allows the processor to operate at different clock speeds and voltages, depending on the user's need for maximum performance or maximum battery life. On AC power, the processor typically runs at maximum frequency and normal voltage. When running off the battery, the processor can run at a lower frequency and voltage to extend battery life. Intermediate modes of operation are also possible, where the system can balance battery life vs. performance needs. Processor mode changes are transparent and occur automatically, based on user preferences; however, a simple Microsoft Windows® control panel interface allows the user the choice of running in other modes.
PowerNow! technology requires specific notebook system and BIOS support.
AMD is working with OEMs and its development partners such as Phoenix Technologies, to help enable the delivery of systems to market with full support for PowerNow! technology later this year.
About 3DNow!™ Technology
3DNow! technology, developed by AMD, was the first innovation to the x86 architecture that significantly enhanced floating-point-intensive 3D graphics and multimedia applications. 3DNow! uses single instruction multiple data (SIMD) and other performance enhancements to provide a compelling visual computing experience.
The worldwide installed base of 3DNow! technology-enhanced PCs has grown to more than 25 million desktop and notebook systems spanning all price points. Support for 3DNow! technology exists today in leading industry-standard application programming interfaces (APIs), including Microsoft DirectX 6.0 and 7.0, and SGI's OpenGL APIs. Additionally, numerous hardware and software products have been optimized for 3DNow! technology.
The Mobile AMD-K6-III+ and Mobile AMD-K6-2+ processors include an enhanced version of 3DNow! technology with new instructions to support digital signal processing (DSP) functions for applications such as MP3 recording, Dolby Digital and Surround Sound processing and soft xDSL modems.
Leading software titles optimized for 3DNow! technology are available on line at the 3DNow! Technology Aisle on Chumbo.com
Pricing and Availability
The Mobile AMD-K6-III+ and Mobile AMD-K6-2+ processors are available now.
(Prices are in 1,000-unit quantities.)
500MHz Mobile AMD-K6-III+ $184
475MHz Mobile AMD-K6-III+ $162
450MHz Mobile AMD-K6-III+ $140
500MHz Mobile AMD-K6-2+ $112
475MHz Mobile AMD-K6-2+ $98
450MHz Mobile AMD-K6-2+ $85
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