AMD Adds Fujitsu PC Corporation as Notebook Customer For Mobile AMD-K6®-2-P Processor

New Fujitsu LifeBook C Series Models Powered by 450MHz Mobile AMD-K6®-2-P Processor with 3DNow!™ Technology

SUNNYVALE, CA -- 10/26/1999 -- AMD continues to expand its customer base for the Mobile AMD-K6®-2-P processor family with the introduction of new models of the popular Fujitsu LifeBook C Series multimedia notebook computer that are powered by the 450MHz Mobile AMD-K6-2-P processor.

Announced today, the new C Series models are designed for consumers and small business customers. Models are available with 13.3" XGA TFT and 12.1" SVGA TFT displays, built-in DVD and CD-ROM drives, and up to 9GB hard drives. Priced starting at $1,499, selected models are planned to be available in November through Fujitsu PC Direct at www.FPCDirect.com or 1-877-FPCDIRECT and through Fujitsu's national and regional retail channels.

"AMD is pleased that Fujitsu PC Corporation has selected the Mobile AMD-K6-2-P processor for its notebook product line," said Dana Krelle, vice president of marketing for the Computation Products Group at AMD. "The market share of AMD processor-based notebooks in the U.S. retail channel exceeded 50 percent in June, July and August 1999 according to PC Data Inc., and the addition of these Fujitsu notebook models further strengthens our position in this channel."

"Fujitsu PC Corporation is excited to announce the addition of Mobile AMD-K6-2-P processor-based models to our popular C Series family," said Steve Andler, vice president of marketing, Fujitsu PC Corporation. "These new models are expected to allow us to offer an exceptional combination of features and performance that add up to great value for the consumer."

About The Mobile AMD-K6®-2-P Processor Family
The Mobile AMD-K6-2-P processor with 3DNow!™ technology delivers excellent performance for today's demanding Microsoft® Windows® compatible home and office applications. The 9.3-million-transistor Mobile AMD-K6-2-P processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow trench isolation at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The Mobile AMD-K6-2-P processor is packaged in a Super7™ platform-compatible, 321-ceramic pin grid array (CPGA) package using C4 flip-clip interconnection technology.

About 3DNow!™ Technology
3DNow! technology, developed by AMD, was the first innovation to the x86 architecture that significantly enhanced floating-point-intensive 3D graphics and multimedia applications. It uses single instruction multiple data (SIMD) and other performance enhancements to provide a compelling visual computing experience.

The worldwide installed base of 3DNow! technology-enhanced PCs has grown to more than 20 million desktop and notebook systems. Support for 3DNow! technology exists today in leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! technology.

Cautionary Statement
This release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are generally preceded by words such as "plans," "expects," "believes," "anticipates" or "intends." Investors are cautioned that all forward-looking statements in this release involve risks and uncertainty that could cause actual results to differ materially from current expectations. Forward-looking statements in this release include the risk that the Fujitsu LifeBook C Series notebook computer systems incorporating Mobile AMD-K6-2-P processors will not be released on schedule or at all, and that the new Fujitsu notebook computer models with AMD-K6-2-P processors will not achieve a combination of features and performance that result in a great product value to the consumer. We urge investors to review in detail the risks and uncertainties in the Company's filings with the Securities Exchange Commission.