National Semiconductor Introduces First Sub-One Watt Pentium Class System-on-a-Chip in Plastic Package
Geode Single-Chip System Available in Plastic BGA Package
Santa Clara, CA --
National Semiconductor Corporation (NYSE:NSM) today announced the availability of its Pentium-class single-chip Geode™ processors in a 40mm thermally enhanced plastic ball grid array (PBGA) package.
The maximum power consumption of the integrated single-chip system is low enough to allow the use of plastic packaging, which significantly reduces component and overall system cost for manufacturers. The SCX200 family of Geode chips incorporates an integrated x86 processor core and all the major system blocks required for a high performance information appliance in one package. These are the only processors with this high level of performance and integration available in a plastic package without an accompanying heatsink.
“National has designed its Geode processors to deliver the ideal performance requirements for today’s interactive set-top boxes, thin clients and Microsoft ‘Mira’-enabled consumer devices,” said Thomas Rothhaupt, director of marketing for National Semiconductor in Asia. “The availability of the Geode single-chip processor in a plastic package makes it simpler and cost effective for manufacturers to build end products that are cost-competitive in existing markets and meet stringent price points at the right performance level in emerging markets.”
“National’s highly-integrated single-chip Geode processors incorporate the critical semiconductor content necessary for placing critical thin-client functionality onto a single chip,” said Brad Rowland, director of product management at Wyse Technology. “This offers us distinct advantages over other processor providers -- highest available performance, lowest available power consumption for long battery life and no cooling fans, and the availability to design products with a small form factor and lower prices.”
The Geode SC1200, SC1210, SC2200 and SC3200 single-chip processors were introduced in an enhanced ball grid array (EBGA) package in September 2000. The single-chip processors include a Geode GX1 32-bit x86 compatible processor module; a TV video processor (SC1200, SC1210), TFT (SC2200), and CRT (SC3200) outputs; memory controller; graphics controller; video input and output ports; core logic with support for PCI, USB and IDE devices; and a Super I/O block – all on a single low power, low cost device.
The Geode SP4SC31 development platform provides a wide range of features that enable manufacturers to design with the single-chip processors in PBGA. This includes stereo audio outputs, mono microphone input, two PCI slots, three USB connectors, an LPC slot, touch screen and button card, an 10/100 Ethernet card, and as separate kits, options for battery power and an RF interface. National provides a complete suite of optimized software drivers for Windows CE.NET, Windows XPe, and Linux (Kernel 2.4.17) as part of the development kit. All interfaces are configured for unique solutions for thin client devices, set-top boxes and consumer devices, including Microsoft “Mira”-enabled devices.
Pricing and Availability
The Geode processor will continue to be available in EBGA packages. The parts in PBGA packaging are available in a range of operating speeds and features, averaging US$25 to US$35, depending on functionality and quantity. They currently are sampling with customers, with full production scheduled for Q3 2002.
About National Semiconductor
National Semiconductor is the premier analog company driving the information age. Combining real-world analog and state-of-the-art digital technology, the company is focused on the fast growing markets for wireless handsets; displays; information infrastructure, and information appliances. With headquarters in Santa Clara, California, National reported sales of $2.1 billion for its last fiscal year and has about 9,800 employees worldwide.