Spansion™ Flash Memory Enhances Mobile 3D Graphics Development on ARM RealView Versatile Platform
Memory solutions for next-generation 3-D mobile phone and PDA designs available from AMD and Fujitsu
Sunnyvale, CA --
FASL LLC today extended its reach in mobile development platforms with the immediate availability of Spansion™ Flash memory upgrade modules for the ARM RealView Versatile Platform for the ARM926EJ-S core. Spansion memory, the world’s leading brand of NOR Flash memory, is manufactured by FASL LLC and available from AMD (NYSE: AMD) and Fujitsu (TSE: 6702).
ARM, one of the industry’s leading providers of 16/32-bit embedded RISC microprocessor solutions, designed the RealView Versatile Platform to enable the rapid development of 3-D graphics, Java and MPEG acceleration technologies on next-generation mobile phones and PDAs. The 640-megabit Spansion Flash memory upgrade module enables hardware and application software developers to prototype and verify ARM-based systems using high-performance and high-density Spansion Flash memory solutions, including products based on MirrorBit™ technology.
“Our customers in the mobile phone and PDA markets, and ultimately end users, benefit when we collaborate with leading vendors of other core wireless technologies,” said Steve Lapinski, Vice President of Systems Engineering and Strategic Alliances for FASL LLC. “ARM technology is positioned to provide the foundation for many of tomorrow’s leading-edge mobile devices, and we are pleased that developers who use ARM technology can build their designs around Spansion Flash memory.”
“As the world’s leading NOR Flash memory brand, Spansion memory is a central component in many wireless designs,” said Alistair Greenhill, Director of Marketing, Development Systems, ARM. “We decided to include this component as an option for customers who are prototyping wireless designs for the mobile phone and PDA markets, in order to maximize the system-level value to designers of ARM core-based products.”
“The 3-D graphics, Java and MPEG acceleration capabilities of the RealView Versatile Platform can demand a unique combination of high throughput and storage space. Fortunately, developers of ARM core-based hardware and application software can now begin using Spansion memory, including high-density devices based on MirrorBit technology, at the start of each design cycle,” explained Amir Mashkoori, Group Vice President and General Manager of the Wireless Business Unit for FASL LLC.
The Spansion Flash memory upgrade board is included with each RealView Versatile Platform Baseboard. The Baseboard is available immediately from ARM for $5000.
About Spansion™ Flash Memory Devices
Spansion™ Flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. Spansion Flash
memory customers represent leaders in the wireless, cellular, automotive, networking, telecommunications and consumer electronics markets. There are a variety of Spansion Flash memory products, such as devices based on the innovative MirrorBit™ technology; the award-winning simultaneous
read-write (SRW) product family; super low-voltage 1.8 volt Flash memory devices; and burst- and page-mode devices. Information about Spansion Flash memory solutions is available at http://www.spansion.com/overview.
Spansion is the global product brand name of FASL LLC, a company formed by the integration of AMD's and Fujitsu’s Flash memory operations. FASL LLC is the largest NOR Flash memory company in the world based on dedicated resources that include gross assets having a net book value of approximately US$3 billion and approximately 7,000 employees. Spansion Flash memory solutions are available worldwide from AMD and Fujitsu.
On the Web
For more Spansion news and product information, please visit our virtual pressroom at www.amd.com/news/virtualpress/index.html. Additional press releases are available at www.amd.com/news/news.html.
Spansion and MirrorBit are trademarks of FASL LLC. AMD is a trademark of Advanced Micro Devices, Inc. Other product and company names used in this publication are for identification purposes only and may be trademarks of their respective companies.