Notebook Computer Based on AMD-K6®-2 Processor with 3DNow!™ Technology Wins PC Magazine Editor's Choice Award
WinBook XL 300 TFT With Mobile AMD-K6®-2/300 Processor Lauded for Performance, Features, Battery Life
SUNNYVALE, CA --
AMD continued to expand its customer base for the Mobile AMD-K6®-2 processor with the introduction by WinBook Computer Corporation of a Mobile AMD-K6-2 processor-based notebook system. The WinBook XL 300 TFT powered by the 300-MHz Mobile AMD-K6-2 with 3DNow!™ technology has been designated an "Editor's Choice" in the February 23 issue of PC Magazine.
The accompanying review noted that "with its standard 64MB of RAM, it earned the highest score in the roundup" versus Intel Celeron processor-based notebooks. "The Editor's Choice-winning WinBook XL 300 TFT combines solid performance with good features and a 3-hour battery life-all for $1,598 (direct)."
WinBook joined Compaq, Packard Bell NEC and Toshiba and others as OEMs who are currently shipping notebook systems based on the AMD-K6 family.
"AMD is committed to delivering powerful performance to PC users," said Larry Hollatz, vice president of AMD's Computation Products Group. "PC Magazine's acknowledgement of the features, performance and price of the Mobile AMD-K6-2 processor-based WinBook XL 300 is a shining example of this."
About the Mobile AMD-K6®-2 Processor
The Mobile AMD-K6-2 processor operates at a core voltage of 1.8 Volts and dissipates less than 8 Watts of power running typical applications. This allows system vendors to offer notebooks with longer battery life and smaller, thinner form factors while retaining excellent performance.
AMD's mobile processors are available in Socket 7 and Super7™ platform-compatible, 321-pin ceramic PGA packages or BGA packages for smaller form factors.
All AMD-K6-2 processors deliver leading-edge, sixth-generation performance for today's demanding Microsoft® Windows® compatible home and office applications. These 9.3-million-transistor processors are manufactured on AMD's 0.25-micron, five-layer-metal process technology at AMD's Fab 25 wafer fabrication facility in Austin, Texas.
About 3DNow!™ Technology
3DNow! technology, the first innovation to the x86 architecture that significantly enhances floating-point-intensive 3D graphics and multimedia applications, uses SIMD (Single Instruction Multiple Data) and other performance enhancements to enable a superior visual computing experience. Introduced as a key feature of the AMD-K6-2 processor in May 1998, 3DNow! technology has more than a six-month time-to-market head start over competing CPU-based 3D enhancement technologies. The worldwide installed base of 3DNow! technology-enhanced PCs is planned to grow to about 14 million systems by the end of this quarter.
Support for 3DNow! technology exists today in the leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous software titles and graphics drivers have been optimized for 3DNow! technology, including software from Microsoft, IBM, id Software, Epic Games and drivers from 3Dfx, nVidia, ATI and Matrox. New optimized titles continue to be added.