AMD Names Raj N. Master Senior Fellow

SUNNYVALE, CA -- 9/19/2001 -- AMD recently named Raj N. Master senior fellow for the Manufacturing Services Group. Raj is one of four current AMD employees who have received this honor. As a member of the technical staff in AMD’s C4 and Advanced Assembly Group, Raj played a key role in the development of AMD’s Controlled Collapsed Chip Connection (C4) packaging, which led to significant savings in packaging and materials for AMD’s microprocessors.

“The backbone of any high-tech company is the technical expertise of its employees. Raj has consistently proven himself not only as a valuable contributor who has greatly expanded AMD’s technical capabilities, but also as someone who is helping drive state-of-the-art packaging technologies for the entire semiconductor industry,” said Chuck Anderson, director in AMD’s Manufacturing Services Division.

Raj has spent 26 years working on C4 technology. He joined AMD in 1996 and was most recently an AMD Fellow responsible for all technical aspects of AMD’s C4 packaging, including assembly process and manufacturing, reliability, and failure analysis. Raj has been granted 20 U.S. patents and has published over 75 technical papers.

Raj received a Bachelor’s of Engineering degree from M.S. University, Baroda and a master’s degree from the Universtity of Missouri- Rolla, both in Metallurgical Engineering.

About AMD
AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets with manufacturing facilities in the United States, Europe, Japan, and Asia. AMD, a Fortune 500 and Standard & Poor’s 500 company, produces microprocessors, flash memory devices, and support circuitry for communications and networking applications. Founded in 1969 and based in Sunnyvale, California, AMD had revenues of $4.6 billion in 2000. (NYSE: AMD).