AMD Adds New Levels of Processing Performance to Embedded BGA Client Platform
Dual-core processors with leading-edge chipsets, graphics capability and BGA packaging offer all-in-one platform
SUNNYVALE, Calif. --8/10/2009
AMD (NYSE: AMD) today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion™ Neo X2 processor Model L625 and the AMD Athlon™ Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.
This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
The addition of these new dual-core processors to the ASB1 BGA platform can help increase the performance of existing single-core designs. When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution that can help streamline development, minimize time to market and offers leading-edge graphics capability, which is increasingly important in many embedded markets. All of AMD’s embedded products are offered with industry-standard 5-year component longevity.
Systems based on the new dual-core processors are expected at launch from industry-leading embedded system providers IBASE and IEI, among others.
“We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets,” said Buddy Broeker, director, Embedded Computing Solutions Division, AMD. “Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”
“The rapid adoption of x86 processors in embedded designs, which is a trend that AMD helped spur in the high-end space, has largely been driven by the need to simplify designs and get them on the market more quickly,” said Eric Heikkila, director, Embedded Hardware and Systems analyst, VDC Research Group. “From the hardware perspective, AMD’s comprehensive platform approach offers mainstream performance, very low power consumption, and takes a lot of the guesswork out of the development process.”
“With the AMD Athlon Neo X2 processor, AMD is offering us a new CPU option that improves on the punch of the single core predecessor with a mere 3 watts increase in processor power consumption,”1 said Dwight Looi, product manager, IBASE Technology. “There is no 18 watt processor on the market that offers our customers precisely the same combination of power efficiency, performance and value, making it a natural choice for our embedded applications.”
For more information on the complete range of AMD’s embedded products, including reference design kits and extensive developer resources, please visit http://www.amd.com/embedded. For further insight into embedded systems, markets and AMD solutions, visit today’s post on the AMD@Work blog.
Advanced Micro Devices (NYSE: AMD) is an innovative technology company dedicated to collaborating with customers and technology partners to ignite the next generation of computing and graphics solutions at work, home and play. For more information, visit http://www.amd.com.
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- Based on comparison of AMD Athlon™ Neo X2 processor at 18W TDP vs. AMD Sempron™ 210U processor at 15W TDP.