Ryzen Pro mobile chip

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Technologies

AMD Ryzen™ 3 PRO 2300U

Specifications
CPU Çekirdek Sayısı
4
İş Parçacığı Sayısı
4
GPU Çekirdek Sayısı
6
Temel Saat Hızı
2GHz
Maks Boost Saat Hızı
3.4GHz
Toplam L1 Ön Bellek
384KB
Toplam L2 Ön Bellek
2MB
Toplam L3 Ön Bellek
4MB
Kilidi açık
Hayır
CMOS
14nm
Paket
FP5
PCI Express Sürümü
PCIe 3.0
Soğutma Çözümü
yok
Varsayılan TDP / TDP
15W
cTDP
12-25W
En Yüksek Sıcaklık
95°C
*İşletim Sistemi Desteği
Windows 10 - 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
System Memory
Maks. Sistem Bellek Hızı
2400MHz
Bellek Tipi
DDR4
Bellek Kanalları
2
Graphics Specifications
Grafik Frekansı
1100 MHz
Grafik Modeli
Radeon™ Vega 6 Graphics
Grafik Çekirdek Sayısı
6
Key Features
Supported Technologies
AMD SenseMI Technology
The “Zen” Core Architecture
Display Port
Yes
HDMI™
Yes
Foundation
Ürün ailesi
AMD Ryzen™ PRO Processors
Ürün serisi
AMD Ryzen™ 3 PRO Mobile Processors with Radeon™ Vega Graphics
Platform
Laptop
OPN Tepsisi
YM230BC4T4MFB
OPN PIB
n/a
Lansman Tarihi
Q1 2019
Footnotes

‡ AMD SenseMI technology is built into all Ryzen™ processors, but specific features and their enablement may vary by product and platform.  For specific capabilities of different processor models, visit www.amd.com/ryzenspecs. If your system is pre-built, contact your manufacturer for additional information.