From Silicon to Systems: Sanmina Hardware Engineering and Manufacturing Roundtable
Abstract
Discover how to eliminate physical-layer bottlenecks and minimize deployment risk in high-density AI clusters. Join AMD and Sanmina engineers as they bridge the gap from chip architecture to validated racks. This session breaks down the engineering realities of silicon alignment, PCB signal integrity, advanced optics, and thermal management to accelerate time-to-compute.
July 23, 2026 2:00 PM - 2:45 PM PDT
Speakers
Presented By
Senior Fellow, Datacenter Platform Management | AMD
General Manager & Vice President, Advanced Microsystems Technologies | Sanmina
Sales and Marketing Director | ZT Systems
Mechanical Engineering Manager | Sanmina