AMD Power Efficiency

Zynq UltraScale+ MPSoCs

In addition to all the power reducing capabilities of UltraScale+ FPGA logic, Zynq™ UltraScale+ MPSoCs utilize multiple power islands and domains within the processing system for coarse-grain and fine-grain dynamic power gating to continually adjust power consumption to performance demands—lowering overall device power.

UltraScale FPGAs

Built on TSMC’s low-power 20nm semiconductor process coupled with significant static and power gating, UltraScale FPGA families deliver up to 40% overall device-level power savings compared to 7 series FPGAs. Architectural enhancements shared with UltraScale+ devices include:

• Hardware-based clock gating
• Hardened block RAM cascading
• DSP block efficiencies
• Power-optimized transceivers

UltraScale power savings

Optimized Power Delivery Solutions

Power management requirements are diverse and often unique to a specific use case. As a result, no single power management design can provide the optimal solution. AMD partners with industry-leading power management companies (listed below) to provide a variety of reference designs that map to common use cases, as well as overall guidance on the power supply requirements of AMD products.

Hardware Verified Power Solutions

Hardware verified power reference designs are designed to meet all AMD power specifications for a targeted device or device family. Hardware verified reference designs ensure that a power solution has been specifically built and tested to meet AMD voltage, current, and sequencing specifications. Performance data and design files are made available by the power vendor to boost your design process.

Non-Hardware Verified Solutions

Non-hardware verified solutions are designed to meet all AMD power specifications and will meet the requirements of a targeted device or device family. Though not hardware verified, they are guaranteed by datasheet specifications.

Thermal Design

Understating the thermal design limits of an application varies greatly between application types and end markets, a lower power design at a high ambient can experience the same thermal challenges as a high power design at a much lower ambient and so understanding what the limits of a system are is critical for both a successful product and a cost effective product, as overdesign a thermal solution incurs extra cost and complexity to a design.

To this end AMD provides DELPHI thermal models for all of current devices, these support both Siemens Flotherm and Ansys IcePak.

Thermal simulation is a critical step in board design and as indicated in the board methodology process chart, the results of the initial estimation should be used for the thermal solution validation.

Thermal Design Partners

Not all customers have access to either the thermal simulation tools or the resources to run a thermal simulation, through the AMD Alliance program you can access partners that have Thermal design capability.

Package selection

An important part of device selection is selecting the right package for a successful thermal design. AMD devices are available in many package types to cater for different customers requirements, however from a thermal standpoint the Lidless packaging offers the best thermal performance, AMD devices are offered in the following packages:

Bare Die – Package Designator (SB/VB)

• "B" indicates Bare Die, S for 0.8mm & V for 0.92mm package pitch

Lidded -  (SF/VF)

• "F" For Forged Lid, S for 0.8mm & V for 0.92mm package pitch

Lidless Package (VS/LS)

• "S" indicated the Stiffener Ring, V for 0.92mm & L for 1mm pitch
• Provides optimal Thermal Performance

Lidless Overhang Package (VI)

• "I" indicates a stiffener ring with package overhead (package substrate larger than the BGA footprint)
• "V" indicates 0.92mm package pitch
• Provides optimal Thermal Performance

Power Estimation

AMD provides best-in-class tools to estimate pre-implementation power consumption, optimize for lowest power at every design stage, and provide extensive analysis for user-guided optimization. Below are a variety of power-related and AMD industry-leading hardware and software-based tools for designers to get started today.

Resources

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