Models and design assets used for thermal analysis, cooling design, and mechanical integration of devices into physical systems.
- Package Thermal Models
- Heat Sink Etch Patterns
- 3D CAD (STEP) Packages
Thermal characterization data used to simulate heat dissipation and ensure reliable device operation under various conditions.
Reference designs for heatsink attachment and PCB footprint patterns to support effective thermal management.
Heat Sink Etch Patterns
Heat Sink Etch Pattern (ZIP - 140.5 KB)
MD5 SUM Value : 8830d5483cc00a0a00fcbef05dfda97d
Last Updated: Apr 30, 2025
Mechanical models of device packages for use in CAD tools to support enclosure design and physical integration.
Versal Adaptive SoC - 3D CAD STEP Models
3D CAD STEP Models (ZIP - 14.85 MB)
MD5 SUM Value : 4701d1bc5ad30fe0f8bd90518e0ee279
Last Updated: Apr 5, 2025