It is mandatory when installing an AMD processor to use some form of thermal interface material. This will help draw the heat out of the processor to the heatsink where the heat can be effectively dissipated. AMD Processor-In-a-Box (PIB) includes a validated heatsink and fan which comes with pre-applied thermal interface material; no additional thermal interface material is needed nor recommended by AMD for the provided heatsink and fan with PIB processors.
New thermal interface material must be applied each time the heatsink and fan are uninstalled from the processor.
AMD evaluates thermal interface materials for use with its processors. A list of suggested materials is provided in the table below.
Suggested Thermal Interface Materials
|Manufacturer||Interface Material||Material Type||Application|
|Bergquist||TIC-3000||Grease||Processor to heatsink|
|Shin Etsu||G751||Grease||Processor to heatsink|
|Shin Etsu||X23-7762||Grease||Processor to heatsink|
|Shin Etsu||X23-7783D||Grease||Processor to heatsink|
|Thermoset, Lord CPD||TC-350||Grease||Processor to heatsink|
|Processor Family||Socket Type|
|AMD Opteron™||940, 939|
|AMD Dual-Core Opteron™||940, 939|
|AMD Athlon™ 64 X2 Dual-Core||AM2, 939|
|AMD Athlon™ 64 FX||AM2, 940, 939|
|AMD Athlon™ 64||AM2, 939, 754|
|AMD Sempron™||AM2, 754|