AMD Instinct MI350 Series and Beyond: Accelerating the Future of AI and HPC

Jun 12, 2025

AMD Instinct MI350 Series Platforms

At a Glance:

  • AMD launched the AMD Instinct™ MI350 Series, delivering up to 4x generation-on-generation AI compute improvement and up to 35x leap in inferencing performance.
  • AMD launched ROCm 7.0 with over 4x inference and 3x training performance improvement over ROCm 6.0
  • AMD also showcased its new developer cloud to empowering AI developers with seamless access to AMD Instinct GPUs and ROCm for their AI innovation.
  • The company also previewed its next-gen “Helios” AI rack infrastructure, integrating MI400 GPUs, EPYC “Venice” CPUs, and Pensando “Vulcano” NICs for unprecedented AI compute density and scalability

The world of AI isn’t slowing down—and neither are we. At AMD, we’re not just keeping pace, we’re setting the bar. Our customers are demanding real, deployable solutions that scale, and that’s exactly what we’re delivering with the AMD Instinct MI350 Series. With cutting-edge performance, massive memory bandwidth, and flexible, open infrastructure, we’re empowering innovators across industries to go faster, scale smarter, and build what’s next.

Powering Tomorrow’s AI Workloads

Built on the AMD CDNA™ 4 architecture, the AMD Instinct MI350X and MI355X GPUs are purpose-built for the demands of modern AI infrastructure. The MI350 Series, delivers a 4x, generation-on-generation AI compute increase1 as well as a 35x generational leap in inferencing, paving the way for transformative AI solutions across industries. These GPUs deliver leading memory capacity (288GB HBM3E from Micron and Samsung Electronics) and bandwidth (up to 8TB/s), ensuring exceptional throughput for inference and training alike.

MI350 Series accelerates your GenAI outcomes
Figure 1 MI350 Series offers faster AI inferencing, supports larger models, and accelerates AI innovation¹

With flexible air-cooled and direct liquid-cooled configurations, the Instinct MI350 Series is optimized for seamless deployment, supporting up to 64 GPUs in an air-cooled rack and up to 128 GPUs in a direct liquid-cooled racks delivering up to 2.6 exaFLOPS of FP4/FP6 performance. The result is faster time-to-AI and reduced costs in an industry standards-based infrastructure.

The Numbers That Matter: Instinct MI350 Series Specifications

SPECIFICATIONS  
(PEAK THEORETICAL)

AMD INSTINCT™ MI350X GPU

AMD INSTINCT™ MI350X PLATFORM

AMD INSTINCT™ MI355X GPU

AMD INSTINCT™ MI355X PLATFORM

GPUs 

Instinct MI350X OAM 

8 x Instinct MI350X OAM 

Instinct MI355X OAM 

8 x Instinct MI355X OAM 

GPU Architecture 

CDNA 4 

CDNA 4 

CDNA 4 

CDNA 4 

Dedicated Memory Size 

288 GB HBM3E 

2.3 TB HBM3E 

288 GB HBM3E 

2.3 TB HBM3E 

Memory Bandwidth 

8 TB/s 

8 TB/s per OAM 

8 TB/s 

8 TB/s per OAM 

FP64 Performance

72 TFLOPs

577 TFLOPs

78.6 TFLOPS

628.8 TFLOPs

FP16 Performance* 

4.6 PFLOPS 

36.8 PFLOPS 

5 PFLOPS 

40.2 PFLOPS 

FP8 Performance* 

9.2 PFLOPs 

73.82 PFLOPs 

10.1 PFLOPs 

80.5 PFLOPs 

FP6 Performance* 

18.45 PFLOPS 

147.6 PFLOPS 

20.1 PFLOPS 

161 PFLOPS 

FP4 Performance* 

18.45 PFLOPS 

147.6 PFLOPS 

20.1 PFLOPS 

161 PFLOPS

*with structured sparsity

AMD Instinct MI350 Series GPUs
Figure 2 AMD Instinct MI355X GPUs deliver leading memory and bandwidth along with impressive performance. *All Matrix Core numbers except FP64 with sparsity
AMD Instinct MI350 Series Platform
Figure 3 The AMD Instinct MI350 Series platform is designed for seamless deployments for demanding workloads

Ecosystem Momentum Ready to Deploy

MI350s will be broadly available through leading cloud service providers—including major hyperscalers and next-generation neo clouds—giving customers flexible options to scale AI in the cloud. At the same time, top OEMs like Dell, HPE, and Supermicro are integrating MI350 Series solutions into their platforms, delivering powerful on-prem and hybrid AI infrastructure. Follow this link to learn how leading OEMs, CSPs and more are supporting the adoption of AMD Instinct MI350 Series GPUs.

ROCm™ 7: The Open Software Engine for AI Acceleration

AI is evolving at record speed—and AMD’s vision with ROCm is to unlock that innovation for everyone through an open, scalable, and developer-focused platform. Over the past year, ROCm has rapidly matured, delivering leadership inference performance, expanding training capabilities, and deepening its integration with the open-source community. ROCm now powers some of the largest AI platforms in the world, supporting major models like LLaMA and DeepSeek from day one, and delivering over 3.5x inference gains in the upcoming ROCm 7 release. With frequent updates, advanced data types like FP4, and new algorithms like FAv3, ROCm is enabling next-gen AI performance while driving open-source frameworks like vLLM and SGLang forward faster than closed alternatives.

As AI adoption shifts from research to real-world enterprise deployment, ROCm is evolving with it too. ROCm Enterprise AI brings a full-stack MLOps platform to the forefront, enabling secure, scalable AI with turnkey tools for fine-tuning, compliance, deployment, and integration. With over 1.8 million Hugging Face models running out of the box, industry benchmarks now in play, ROCm is not just catching up—it’s leading the open AI revolution.

Developers are at the heart of everything we do. We're deeply committed to delivering an exceptional experience—making it easier than ever to build on ROCm with better out-of-box tools, real-time CI dashboards, rich collateral, and an active developer community. From hackathons to high-performance kernel contests, momentum is building fast. And today, we're thrilled to launch the AMD Developer Cloud, giving developers instant, barrier-free access to ROCm and AMD GPUs to accelerate innovation.

Whether optimizing large language models or scaling out inferencing platforms, ROCm 7 gives developers the tools they need to move from experimentation to production fast. Be sure to check out our blog that goes into more detail on all the benefits found within ROCm 7.

What’s Next: Previewing the AMD Instinct MI400 Series and “Helios” AI Rack

The AMD commitment to innovation doesn’t stop with Instinct MI350 Series. The company previewed its next-generation AMD Instinct MI400 Series—a new level of performance coming in 2026.

The AMD Instinct MI400 Series will represent a dramatic generational leap in performance enabling full rack level solutions for large scale training and distributed inference. Key performance innovations include2:

  • Up to 432GB of HBM4 memory
  • 19.6TB/s memory bandwidth
  • 40 PF at FP4 and 20 PF at FP8 performance
  • 300GB/s Scale-Out bandwidth 

The “Helios” AI rack infrastructure – coming in 2026 – is engineered from the ground up to unify AMD’s leadership silicon—AMD EPYC “Venice” CPUs, Instinct MI400 series GPUs and Pensando “Vulcano” AI NICs—and ROCm software into a fully integrated solution. Helios is designed as a unified system supporting a tightly coupled scale-up domain of up to 72 MI400 series GPUs with 260 terabytes per second of scale up bandwidth with support for Ultra Accelerator Link.

Read the blog here for more information about what’s ahead with the AMD “Helios” AI rack solution.

Laying the Foundation for the Future of AI

Built on the latest AMD CDNA 4 architecture and supported by the open and optimized ROCm software stack, Instinct MI350X and MI355X GPUs enable customers to deploy powerful, future-ready AI infrastructure today.

ROCm is unlocking AI innovation with open-source speed, developer-first design, and breakthrough performance. From inference to training to full-stack deployment, it’s built to scale with the future of AI.
And with ROCm 7 and AMD Developer Cloud, we’re just getting started.

As we look ahead to the next era of AI with the upcoming MI400 Series and AMD “Helios” rack architecture, the Instinct MI4000 Series sets a new standard—empowering organizations to move faster, scale smarter, and unlock the full potential of generative AI and high-performance computing.

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Vamsi Boppana

Senior Vice President, Artificial Intelligence Group, AMD

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Footnotes
  1. MI350-004  - Based on calculations by AMD Performance Labs in May 2025, to determine the peak theoretical precision performance of eight (8) AMD Instinct™ MI355X and MI350X GPUs (Platform) and eight (8) AMD Instinct MI325X, MI300X, MI250X and MI100 GPUs (Platform) using the FP16, FP8, FP6 and FP4 datatypes with Matrix. Server manufacturers may vary configurations, yielding different results. Results may vary based on use of the latest drivers and optimizations. 
  2. Based on AMD engineering projections. Subject to change when actual product is in-market.

This blog contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products and roadmaps; AMD’s AI platform; and AMD’s partner ecosystem, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this blog are based on current beliefs, assumptions and expectations, speak only as of the date of this blog and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures, and licensing requirements; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving  expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes, the revolving credit agreement and the ZT Systems credit agreement; impact of acquisitions, joint ventures and/or strategic investments on AMD’s business and AMD’s ability to integrate acquired businesses, including ZT Systems; AMD’s ability to sell the ZT Systems manufacturing business; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.