AMD product reliability exceeds standard industry requirements by applying knowledge-based qualification methodologies and demonstrating world class reliability results on leading-edge technology nodes. All products must meet unique and stringent quality and reliability exit-criteria (standards-based JEDEC, IPC, IEC, AEC, MIL-STD, knowledge-based methodology) before production release.

Reliability Qualification

AMD products are thoroughly evaluated to meet our customers’ product life and performance expectations. AMD uses accelerated stress and lifetime modeling to deliver robust field operation.

Typical reliability stress tests include but are not limited to:

  • High Temperature Operating Life (HTOL) Test
  • Preconditioning Test
  • Temperature Cycling Test (TCT)
  • Highly Accelerated Stress Test (HAST)
  • Temperature and Humidity Bias (THB)
  • High Temperature Storage (HTS)
  • Mechanical Shock and Vibration (MSV)
  • Electrostatic Discharge (ESD)
  • Latch-up
  • Soft Error Rate Evaluations (SER)
  • Board Level Reliability Characterization

From this learning, we continuously drive design and test improvements and strive to meet the highest standards set by AMD, the industry and our customers.