Reduce Memory Bottlenecks. Simplify System Design.

The AMD Versal™ Premium Gen 2 Memory on Package (MoP) adaptive SoC integrates compute and memory to deliver high performance, simplified design, and faster time-to-market.

Smaller Footprint

Up to 60% board area savings for compact system design1

Higher Bandwidth

Up to 288 GB/s projected DRAM bandwidth for data-intensive workloads2

Faster Time to Market

Simplified board design and reduced validation complexity3

Long Lifecycle

15-year lifecycle with industrial temperature support4

Explore the Architecture

Shrink the Footprint. Scale the Bandwidth.

Versal Premium Gen 2 MoP adaptive SoCs integrate DRAM directly into the package, helping eliminate need for external memory interfaces and reducing board size and complexity.

  • Integrated DRAM + adaptive SoC
  • 5% higher bandwidth vs. an onboard LPDDRX solution5
  • Up to 288 GB/s projected memory bandwidth
  • Small form factor: over 60% area savings1
  • Enables PCIe® and 3U VPX form factors
  • 15+ year lifecycle support4
AMD Versal Premium Gen 2 Product Brief
AMD Versal Premium Gen 2 Listicle

Accelerate Time to Market Without Compromise

High bandwidth, compact footprint, faster bring-up.

While systems push to higher levels of performance in smaller form factors, the need to get your products to market faster is more intense than ever. Versal Premium Gen 2 MoP can save months of engineering effort because this memory interface has already been designed and verified for you.

Applications

Woman working in a broadcast control room on a tv station

Efficient Memory for Real-Time Broadcast AV Systems

By integrating LPDDR5X directly into AMD Versal Premium Gen 2 Memory on Package, Broadcast AV systems can integrate high-bandwidth, low-latency multichannel video, AI processing, and IP networking with reduced board complexity and long-term supply stability.

PXI Test System powered by AMD Versal Premium Gen 2 MoP

High Bandwidth PXI Test Solutions Powered by AMD Versal Premium Gen 2 MoP

Meet next gen test bandwidth head on with AMD Versal Premium Gen 2 MoP, which powers high throughput instrumentation and wireless test in a compact PXI form factor

Product Table

Device Name

2VP3422

2VP3522

2VP3622

System Logic Cells (K)

2,561

3,273

3,273

CLB LUTs (K)

1,172

1,496

1,496

Total RAM (Mb)*

256

327

327

Integrated LPDDR5X Capacity / Controllers

32 GB / Eight x32b

32 GB / Eight x32b

32 GB / Eight x32b

DSP Engines

6,080

2,512

7,616

PCIe® w/ DMA & CXL® 3.1 (CPM6)

2x Gen6x8

2x Gen6x8

2x Gen6x8

Max. I/O (XP5IO/MIO)

194 / 78

194 / 78

194 / 78

GTM2 Transceivers

56

72

72

* Total RAM = Maximum Distributed RAM + Total Block RAM + Total UltraRAM

Verify all data in the above table with the device data sheets or product guides.

Scale Memory Bandwidth Without Relearning Your Design Flow

Engineers familiar with designing on Versal Premium Series Gen 2 can transition to Versal Premium Gen 2 Memory on Package devices with minimal changes to their existing development flow.

Versal Premium Gen 2 MoP devices use the same AMD Vivado™ and Vitis™ tool environment, the same programmable logic architecture, and the same NoC-based system design methodology you already know from Versal Premium Series Gen 2.

Abstract blue and orange connected nodes

Benefits include:

Familiar Vivado IP Integrator workflows

Existing RTL and software development flows

Consistent timing closure and implementation methodology

Reuse of existing design expertise and infrastructure

The difference is a set of system-level advantages that come with a higher level of integration.

With memory integrated directly into the package, Versal Premium Gen 2 MoP devices simplify board design, reduce high-speed memory routing complexity, and enable higher memory bandwidth density — while preserving a familiar AMD adaptive SoC development experience. For teams already targeting Versal Premium Series Gen 2, Versal Premium Gen 2 MOP is an easy migration.

Support & Resources

Frequently Asked Questions

Memory on Package (MoP) integrates DRAM directly with the adaptive SoC in a single package, rather than placing memory separately on the board. This approach helps eliminate the need for external memory routing and interface design, helping simplify development while improving system performance and efficiency.

By integrating memory into the package, MoP helps eliminate many of the challenges associated with external memory interfaces, such as signal integrity (SI) and power integrity (PI) considerations. This can significantly simplify board layout and reduce validation effort, helping accelerate development timelines.

Versal Premium Gen 2 MoP delivers high memory bandwidth—up to 288 GB/s projected—enabling efficient processing of data-intensive workloads. The integrated architecture also helps improve overall system efficiency compared to traditional onboard memory approaches.

This solution is well suited for compute- and memory-intensive and space-constrained applications, including: aerospace & defense systems (e.g., 3U VPX), professional AV and broadcast equipment, and test and measurement systems. These applications benefit from the combination of a compact footprint, high bandwidth, and simplified design.

Versal Premium Gen 2 MoP devices are designed for long-life deployments, offering 15+ year lifecycle⁴ and support for industrial temperature ranges (-40°C to 110°C). This makes them suitable for mission-critical and embedded applications that require long-term availability and reliability.

Design Without Compromise

Discover how Versal Premium Gen 2 Memory on Package adaptive SoCs can help you build compact, high-performance systems with faster development cycles.

Footnotes
  1. Based on AMD internal measurements taken in April 2026, of the board area of Versal Premium Series Gen 2 MoP 2VP3622 adaptive SoC, compared to the board area of a Versal Premium Series Gen 2 monolithic adaptive SoC with external memory. (VER-111)
  2. Compared to Versal Premium Series Gen 2 coupled with external LPDDR5X DRAM, which supports up to 270 GB/s of total memory bandwidth
  3. Based on AMD internal analysis, comparing the pre-designed and pre-verified LPDDR5X board-level memory interface integrated in AMD Versal Premium Gen 2 MoP adaptive SoCs to platforms offering external LPDDR5 memory. (VER-110)
  4. Product lifecycle targets are based on AMD product program objectives and lifecycle management practices and may extend beyond the availability of individual third-party components. Component availability, including memory, is subject to supplier roadmaps and may vary. AMD may offer supply assurance options or other lifecycle management solutions to support long-term availability; contact AMD sales for details. (GD-254)
  5. Based on AMD internal analysis taken in July 2026 comparing the memory bandwidth specifications of Versal Premium Gen 2 MoP 2VP3622 adaptive SoC compared to the Versal Premium Series Gen 2 monolithic adaptive SoC with external memory. (VER-113)