Introducing AMD EPYC Embedded 2005 Series Processors, Delivering Power-Efficient Performance in a Compact Design for Constrained Networking, Storage, and Industrial Environments

Dec 09, 2025

Close-up of blue EPYC Embedded processor with central EPYC Embedded chip and surrounding component grid on metallic frame.

News Snapshot: 

  • AMD EPYC Embedded™ 2005 Series offers high compute density and power efficiency in a compact package for power, thermal and space-constrained environments
  • Supports PCIe® Gen5, high-speed DDR5 memory, and advanced RAS and security features, enabling reliable and scalable designs for long-life deployments
  • Optimized for networking, storage, and industrial systems requiring 24/7 operations and outstanding performance per watt

AI-driven workloads are transforming the performance and efficiency requirements of embedded infrastructure systems. From networking switches, routers, and DPU control planes to cold cloud storage, aerospace and robotics applications, today’s embedded computing system architects  must deliver higher compute density, energy efficiency, and extended longevity—within smaller, power-constrained designs.

AMD is addressing these evolving requirements with the introduction of the AMD EPYC™ Embedded 2005 Series processors delivering high-performance, energy efficiency, and advanced reliability and security in a small BGA (ball grid array) footprint for network, storage and industrial infrastructure systems requiring 24/7 operation. 

Exceptional Performance and Efficiency in a Compact Design

AMD EPYC Embedded 2005 processors deliver strong performance per watt and I/O throughput in a highly integrated 40mm × 40mm BGA package, which is 2.4 times smaller than comparable Intel Xeon 6500P-B solutions1. The BGA package enables designers to optimize both performance and system cost by allowing for a higher density of I/O connections, shorter electrical paths for increased signal integrity, and superior thermal management. 

Powered by the proven “Zen 5” architecture, the series features up to 16 x86 cores and 64 MB of shared L3 cache, along with configurable thermal design power (TDP) ranging between 45W and 75W with precise tuning for diverse thermal and power profiles.

EPYC Embedded 2005 processors provide up to a 28 percent higher boost CPU frequency and 35 percent higher base CPU frequency, at half the TDP of the comparable Intel Xeon 6503P-B2, enabling superior performance density and lower total system cost. 

This balance of compute capability and power efficiency makes the AMD EPYC Embedded 2005 Series ideally suited for constrained networking, storage and industrial systems where every watt and millimeter count.

Built for Reliability, Security, and Longevity

Engineered for 24/7 always-on performance, the AMD EPYC Embedded 2005 processors support up to 10 years of continuous field operation. Extended product longevity and support also include up to 10 years of component ordering and technical assistance, plus 15 years of software maintenance, helping to optimize design stability and long-term return on investment. 

Advanced Reliability, Availability, and Serviceability (RAS) features proactively detect, prevent, and correct errors to minimize downtime and extend system lifespan. Application-specific features such as Baseboard Management Controller (BMC) support, PCIe Hot Plug, and multi-SPI ROM enhance design flexibility for networking and storage environments. 

AMD Infinity Guard security features—including AMD Secure Processor3, AMD Platform Secure Boot, and AMD Memory Guard—help protect data integrity and system reliability in mission-critical deployments. 

High-Speed Connectivity and Open Software Ecosystem

The AMD EPYC Embedded 2005 processors deliver modular design flexibility and exceptional I/O throughput with 28 lanes of PCIe Gen5. Engineers can aggregate up to 16  PCIe lanes to integrate high-speed Ethernet NICs, FPGAs, or networking ASICs. DDR5 memory support provides higher memory bandwidth and a seamless migration path as DDR4 begins its end-of-life.  

Developers also benefit from a rich open-source software environment, including upstream support for Yocto, kernel drivers, and EDK II (Extended Development Kit), which simplify integration and accelerate time to market.

Enabling the Next Generation of Embedded Infrastructure

As constrained networking, storage and industrial workloads continue to evolve, the AMD EPYC Embedded 2005 processor with powerful Zen 5 cores, scalable I/O, and robust security and longevity, delivers the performance, power efficiency, and long-term reliability required for next generation, AI-driven, connected systems.

For more information, please visit: https://www.amd.com/en/products/embedded/epyc/2005-series.html

Footnotes
  1. Based on AMD internal analysis as of November 2025. AMD EPYC™ Embedded 2005 Series has a 40mm x 40mm (1,600mm2) BGA package size. Intel Xeon™ 6500P-B Series has a 77.5mm x 50mm (3,875mm2) BGA package size.

    (3,875mm2 – 1,600mm2) / 1,600 mm2 =142% smaller package area or 2.42x smaller

    Intel Xeon 6500P-B Processor specifications:  https://www.intel.com/content/www/us/en/products/details/processors/xeon/edge.html. EE2-003

  2. Based on AMD internal analysis as of November 2025. AMD EPYC™ Embedded 2655 is a 12-core “Zen 5” processor model with a 4.5GHz 1T Boost CPU frequency.

    Intel Xeon™ 6503P-B is a 12-core processor model with a 3.5GHz Boost CPU frequency.

    Intel Xeon™ 6516P-B is a 20-core processor model with a 3.5GHz Boost CPU frequency.

    (4.5 GHz – 3.5 GHz) / 3.5 GHz = 28% higher Boost CPU frequency or 1.28x better.

    Intel Xeon™ 6503P-B specifications:  https://www.intel.com/content/www/us/en/products/sku/242897/intel-xeon-6503pb-processor-48m-cache-2-00-ghz/specifications.html

    Intel XeonTM 6516P-B specifications: https://www.intel.com/content/www/us/en/products/sku/242898/intel-xeon-6516pb-processor-80m-cache-2-30-ghz/specifications. EE2-005

    Based on AMD internal analysis as of November 2025. AMD EPYCTM Embedded 2655 is a 12-core “Zen 5” processor model with a 2.7 GHz Base CPU frequency and 55W nominal TDP.

    Intel XeonTM 6503P-B is a 12-core processor model with a 2.0 GHz Base CPU frequency and 110W nominal TDP

    (2.7 GHz – 2.0 GHz) / 2.0 GHz = 35% higher Base CPU frequency or 1.35x better

    (110W – 55W) / 100W = 0.5x or half the TDP

    Intel XeonTM 6503P-B specifications: https://www.intel.com/content/www/us/en/products/sku/242897/intel-xeon-6503pb-processor-48m-cache-2-00-ghz/specifications.html.EE2-004

  3. The AMD Secure Processor is a dedicated on-chip security processor integrated within each system-on-a-chip (SoC) and ASIC (Application Specific Integrated Circuit) designed by AMD. It enables secure boot with root of trust anchored in hardware, initializes the SoC through a secure boot flow, and establishes an isolated Trusted Execution Environment. GD-72.
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